Open and closed loop manipulation of charged microchiplets in an electric field

Lu, Jeng Ping; Thompson, J. D.; Whiting, Gregory L.; Biegelsen, D. K.; Raychaudhuri, Sourobh; Lujan, R.; Veres, János; Lavery, Leah; Völkel, A. R.; Chow, Eugene M.

doi:10.1063/1.4891957

Cited by 20 publications

(12 citation statements)

References 20 publications

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“…First, there should be exactly one chiplet directed to the desired location, and second, the chiplet needs to be placed with well-defined orientation because functional chips generally do not have rotational symmetry. These basic steps in the chiplet assembly process have been demonstrated and illustrate the feasibility of this new approach to microscale manufacturing [29].…”

Section: Printing Microchipsmentioning

confidence: 92%

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From Printed Transistors to Printed Smart Systems

Street

Schwartz

et al. 2015

Proc. IEEE

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Printing as a manufacturing technique is a promising approach to fabricate low-cost, flexible and large area electronics. Higher performance can be achieved with printed hybrid electronics.ABSTRACT | Printing as a manufacturing technique is a promising approach to fabricate low-cost, flexible, and large area electronics. Over the last two decades, a wide range of applications has been explored, among them displays, sensors, and printed radio-frequency identification devices. Some of these turned out to be challenging to commercialize due to the required infrastructure investment, accuracy or performance expectations compared to incumbent technologies. However, the progress in terms of material science, device, and process technology now makes it possible to target some realistic applications such as printed sensor labels. The journey leading to this exciting opportunity has been complex. This review describes the experience and current efforts in developing the technology at PARC, a Xerox Company. Printed smart labels open up low-cost solutions for tracking and sensing applications that require high volumes and/or would benefit from disposability. Examples include radiation tags, one-time use medical sensors, tracking the temperature of pharmaceuticals at the item level, and monitoring food sources for spoilage and contamination. Higher performance can be achieved with printed hybrid electronics, integrating microchip-based signal processing, wireless communication, sensing, multiplexing, as well as ancillary passive elements for low-profile microelectronic devices, opening up further applications. This technology offers custom circuitry for demanding applications and is complementary to mass printed transistor circuits. As an example, we describe a prototype sense-and-transmit system, focusing particularly on issues of integration, such as imped-ance matching between the sensor and circuits, robust printed interconnection of the chips, and compatible interface electronics between printed and discrete parts. Next-generation technologies will enable printing of entire smart systems using microchip inks. A new printing concept for the directed assembly of silicon microchips into functional circuits is described.The process is scalable and has the potential to enable additive, digital manufacturing of high-performance electronic systems.

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Section: Printing Microchipsmentioning

confidence: 92%

“…(d) Interconnects using ink-jet printing (inset) to give complete circuits. Reprinted with permission from[29].…”

mentioning

confidence: 99%

From Printed Transistors to Printed Smart Systems

Street

Schwartz

et al. 2015

Proc. IEEE

Self Cite

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“…Electrostatic assembly exploits the adhesive force induced by an external electric field across a set of conductive electrodes to manipulate microcomponents [ 281 , 282 , 283 , 284 , 285 , 286 , 287 , 288 , 289 ]. In other words, charged microcomponents can be trapped by patterned surface areas with localized electrical fields.…”

Section: Chip-scale Transfer Techniquesmentioning

confidence: 99%

Layer-Scale and Chip-Scale Transfer Techniques for Functional Devices and Systems: A Review

Gong

2021

Nanomaterials

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Hetero-integration of functional semiconductor layers and devices has received strong research interest from both academia and industry. While conventional techniques such as pick-and-place and wafer bonding can partially address this challenge, a variety of new layer transfer and chip-scale transfer technologies have been developed. In this review, we summarize such transfer techniques for heterogeneous integration of ultrathin semiconductor layers or chips to a receiving substrate for many applications, such as microdisplays and flexible electronics. We showed that a wide range of materials, devices, and systems with expanded functionalities and improved performance can be demonstrated by using these technologies. Finally, we give a detailed analysis of the advantages and disadvantages of these techniques, and discuss the future research directions of layer transfer and chip transfer techniques.

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“…Electric fields can be designed to manipulate colloidal assembly in space and time in a manner that overcomes many limitations of other external fields. Electric fields can be shaped across length scales with different electrode designs ( 18 ) including arrays ( 19 , 20 ) and patterns ( 21 , 22 ). This spatial control of electric field shape and amplitude along with fast transient responses provides capabilities for rapid control over colloidal assembly and reconfiguration.…”

Section: Introductionmentioning

confidence: 99%

Controlling colloidal crystals via morphing energy landscapes and reinforcement learning

et al. 2020

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We report a feedback control method to remove grain boundaries and produce circular shaped colloidal crystals using morphing energy landscapes and reinforcement learning–based policies. We demonstrate this approach in optical microscopy and computer simulation experiments for colloidal particles in ac electric fields. First, we discover how tunable energy landscape shapes and orientations enhance grain boundary motion and crystal morphology relaxation. Next, reinforcement learning is used to develop an optimized control policy to actuate morphing energy landscapes to produce defect-free crystals orders of magnitude faster than natural relaxation times. Morphing energy landscapes mechanistically enable rapid crystal repair via anisotropic stresses to control defect and shape relaxation without melting. This method is scalable for up to at least N = 103 particles with mean process times scaling as N0.5. Further scalability is possible by controlling parallel local energy landscapes (e.g., periodic landscapes) to generate large-scale global defect-free hierarchical structures.

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Open and closed loop manipulation of charged microchiplets in an electric field

Cited by 20 publications

References 20 publications

From Printed Transistors to Printed Smart Systems

From Printed Transistors to Printed Smart Systems

Layer-Scale and Chip-Scale Transfer Techniques for Functional Devices and Systems: A Review

Controlling colloidal crystals via morphing energy landscapes and reinforcement learning

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