Online tool condition monitoring for ultrasonic metal welding via sensor fusion and machine learning

Nazir, Qasim; Shao, Chenhui

doi:10.1016/j.jmapro.2020.12.050

Cited by 39 publications

(14 citation statements)

References 38 publications

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“…The wire loop profile is also one of the important factors that affects the bonding reliability. At present, machine learning (ML) algorithm has received great attention in the process modeling, which provides vital guidance for establishing new wire loop models [ 49 , 50 , 51 ]. Hou et al [ 52 ] proposed and demonstrated an efficient wire loop profile prediction model based on ML algorithm and FEA.…”

Section: Au Bonding Wirementioning

confidence: 99%

Research Progress on Bonding Wire for Microelectronic Packaging

et al. 2023

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Wire bonding is still the most popular chip interconnect technology in microelectronic packaging and will not be replaced by other interconnect methods for a long time in the future. Au bonding wire has been a mainstream semiconductor packaging material for many decades due to its unique chemical stability, reliable manufacturing, and operation properties. However, the drastic increasing price of Au bonding wire has motivated the industry to search for alternate bonding materials for use in microelectronic packaging such as Cu and Ag bonding wires. The main benefits of using Cu bonding wire over Au bonding wire are lower material cost, higher electrical and thermal conductivity that enables smaller diameter Cu bonding wire to carry identical current as an Au bonding wire without overheating, and lower reaction rates between Cu and Al that serve to improve the reliability performance in long periods of high temperature storage conditions. However, the high hardness, easy oxidation, and complex bonding process of Cu bonding wire make it not the best alternative for Au bonding wire. Therefore, Ag bonding wire as a new alternative with potential application comes to the packaging market; it has higher thermal conductivity and lower electric resistivity in comparison with Cu bonding wire, which makes it a good candidate for power electronics, and higher elastic modulus and hardness than Au bonding wire, but lower than Cu bonding wire, which makes it easier to bond. This paper begins with a brief introduction about the developing history of bonding wires. Next, manufacturability and reliability of Au, Cu, and Ag bonding wires are introduced. Furthermore, general comparisons on basic performance and applications between the three types of bonding wires are discussed. In the end, developing trends of bonding wire are provided. Hopefully, this review can be regarded as a useful complement to other reviews on wire bonding technology and applications.

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Section: Au Bonding Wirementioning

confidence: 99%

Research Progress on Bonding Wire for Microelectronic Packaging

et al. 2023

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“…Zhao J. et al studied and analyzed the information security technology of Internet of ings applied in smart grid, and put forward the protection system and security measures of Internet of ings information security system applied in smart grid [11]. Nazir and Shao studied and analyzed the wireless communication system of Internet of ings and proposed a wireless communication guarantee mechanism of Internet of ings for smart grid [12]. Nazir and Shao proposed to combine the Internet of ings and EPON technology to analyze the security system of the Internet of ings under the background that the Internet of ings is used in smart grid and based on the current situation and technical characteristics of power communication network resources, so as to provide premise guarantee for the wide application and construction of the Internet of ings in smart grid [12].…”

Section: Literature Reviewmentioning

confidence: 99%

Intelligent Online Monitoring Technology of Green Power Transmission and Transformation Equipment Based on Internet of Things

Tian²,

Zhang

2022

Mobile Information Systems

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To address the problems of insufficient real-time monitoring data, insufficient accuracy, and low reliability of current power grid monitoring systems, we offer intelligent online monitoring technology research of green energy transmission and conversion devices based on Internet technology. The sensor tag is integrated with various electrical equipment status monitoring sensors, so that the electrical equipment status acquisition terminal has the ability of recognition and perception. Firstly, the propagation characteristics of electromagnetic wave in substation are analyzed, and the propagation path loss model of electromagnetic wave is established. Secondly, a multiantenna RFID system is proposed to solve the problem of electromagnetic wave multipath effect. Moreover, the communication channel model of substation multiantenna (radio frequency identification, RFID) monitoring system is established, the factors affecting the performance of substation multiantenna RFID system are analyzed, and the precautions for the installation of multiantenna RFID system are put forward. A new anticollision algorithm is proposed compared to the traditional algorithm, based on the interference of collisions between the sensor markings of the multiantenna RFID control system in the substation. The results show that as the number of sensor markings increases, the total duration of the enhanced adaptive time slot and multitree search collision (improved adaptive time slot and multitree search anticollision, IATMSA) algorithm is always less than that of the IAMS algorithm and the square algorithm, basically maintained at 50% to 60%, up to about 75%. In the improved adaptive multitree search (improved adaptive multitree search, IAMS) anticollision algorithm, the IAMS algorithm determines the choice by calculating the size of the collision factor. The binary tree algorithm is basically about 45%, and the quadtree algorithm is basically about 30%. Figure shows the online monitoring technology for power transmission and conversion devices based on Internet of Things technology.

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“…Using machine learning, fast and precise predictions can be made about process parameters and results, and multi-dimensional sensor signals can be merged and interpreted. In modern industrial production facilities, sensor data fusion and predictive maintenance are already being used in the field to compare target and actual data and have proven to be accelerators here ( Aliustaoglu et al, 2009 ; Hashemian, 2011 ; Indri et al, 2019 ; Nazir and Shao, 2021 ; Pech et al, 2021 ). Nowadays, medicine and medical technology use image processing methods to segment and classify structures in order to draw conclusions about diseases and the resulting therapies ( Liu et al, 2019 ; Shi et al, 2021 ).…”

Section: 1 Analysis Of the Automation Potential Of The Most Prominent...mentioning

confidence: 99%

Scalable Biofabrication: A Perspective on the Current State and Future Potentials of Process Automation in 3D-Bioprinting Applications

Lindner

Blaeser

2022

Front. Bioeng. Biotechnol.

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Biofabrication, specifically 3D-Bioprinting, has the potential to disruptively impact a wide range of future technological developments to improve human well-being. Organs-on-Chips could enable animal-free and individualized drug development, printed organs may help to overcome non-treatable diseases as well as deficiencies in donor organs and cultured meat may solve a worldwide environmental threat in factory farming. A high degree of manual labor in the laboratory in combination with little trained personnel leads to high costs and is along with strict regulations currently often a hindrance to the commercialization of technologies that have already been well researched. This paper therefore illustrates current developments in process automation in 3D-Bioprinting and provides a perspective on how the use of proven and new automation solutions can help to overcome regulatory and technological hurdles to achieve an economically scalable production.

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Online tool condition monitoring for ultrasonic metal welding via sensor fusion and machine learning

Cited by 39 publications

References 38 publications

Research Progress on Bonding Wire for Microelectronic Packaging

Research Progress on Bonding Wire for Microelectronic Packaging

Intelligent Online Monitoring Technology of Green Power Transmission and Transformation Equipment Based on Internet of Things

Scalable Biofabrication: A Perspective on the Current State and Future Potentials of Process Automation in 3D-Bioprinting Applications

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