Online Research on Reliability of Thermal-Vibration Coupling for PLC Optical Splitters

Design and optimization of 1 × 8 PLC splitter with backpropagation neural networks and genetic algorithm

“…Fiber-to-the-home (FTTH) technology, characterized by high bandwidth, low latency and stability, is widely used [3]. At the heart of this technology is the planar lightwave circuit (PLC) splitter, facilitating signal distribution and connection, offering a compact and integrated solution [4]. Common in PLC splitters is the uniform splitter, with channel * Author to whom any correspondence should be addressed.…”

Study on the Design of Thermal Vibration Integrated Reliability Enhancement test Profile based on Multi-stress Failure Excitation Simulation

“…The microstructure and crack extension behavior of CCGA (Ceramic Column Grid Array) solder joints after sinusoidal vibration loading, random vibration loading and thermal cycling tests are discussed; Jiao et al [17] Characterized the response of the board and solder interconnections and on this basis studied the failure modes and failure lifetimes in relation to the coupling conditions. Han et al [18] analyzed and optimized the sensitivity of the morphological parameters of CSP solder joints in three-dimensional packages under thermal-vibration coupling conditions; Sheng et al [19] studied the effect of different vibration directions on the damage mechanism of BGA under coupling conditions; Li et al [20] studied the physical model of probabilistic failure of BGA solder joints with multi-field coupling In addition to thermal vibration coupling of solder joints, Zhang et al [21] conducted a temperature-vibration coupling analysis and performance study of commercial 18650 Li-ion batteries; Zheng et al [22] studied the reliability of thermal vibration coupling of PLC optical splitters; Shi et al [23] presents a vibration analysis model for functional gradient conical-cylindrical coupled shells (FG-CCCS) subjected to thermal environments; He et al [24] Research through the air temperature-vibration coupling test system provides a solution for obtaining high-performance ATPCs; Fan et al [25] summarized the fatigue theory and the multi-field coupled numerical analysis theory, and on this basis, proposed a numerical analysis method for thermal vibration coupling of TSV copper (TSV-Cu). In summary, the relevant research on temperature-vibration synthesis is basically mature, and the physical effects and failure mechanisms of different products subjected to temperature-vibration are basically the same.…”