Thermal contact resistance, a parameter that describes the thermal transferability of the interface between the melt and the metallic wall, exercises a significant influence on the surface quality of the resulting part, especially in thin wall injection molding. In this study, temperature data of the melt was quantitatively measured with only 2 micro thermocouples, and TCR of specimens with 4 kinds of thickness was calculated after data processing with a new mathematical model. It was demonstrated that TCR was deeply affected by mold temperature. When the mold temperature increased from 90 °C to 130 °C, the rate of TCR decline was 56.72 %. Melt cooling simulation was performed with different values of TCR, which played the dominant role of TCR in calculating the temperature distribution in thin-wall injection molding. It showed that TCR exercises a significant influence on the simulation of the cooling rate, and the influence cannot be ignored, especially in thin-wall injection molding.
The side wall profile roughness of the silicon waveguide prepared by electron beam lithography and reactive ion etching is extracted by using the boundary tracing method. The maximum, minimum, and average roughness values are extracted from the side wall boundary, and the changes of the side wall boundary of waveguide after electron beam exposure and reactive ion etching were compared. The roughness variation of the waveguide side wall is similar with the same length. And roughness from the bottom of the waveguide etched region is measured directly by laser confocal microscope and roughness correlation statistics are also obtained.
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