Online High-Precision Vision Measurement Method for Large-Size Gear Parameters

Wan, Fuchun; Luo, Huifu; Liu, Junliang

doi:10.1145/3378891.3378895

Cited by 3 publications

(2 citation statements)

References 1 publication

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“…Most often this process is done using the algorithm that searches for gradient transitions. Then the pixel and subpixel contours are detected which leads to determination of an object outline and its application to the original image [ 25 , 26 , 27 , 28 , 29 ]. The process is presented schematically in Figure 1 .…”

Section: Methodsmentioning

confidence: 99%

Assessment of Background Illumination Influence on Accuracy of Measurements Performed on Optical Coordinate Measuring Machine Equipped with Video Probe

Harmatys

Gąska

et al. 2021

Sensors

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Currently the Coordinate Measuring Technique is facing new challenges both in terms of used methodology and a speed of measurement. More and more often modern optical systems or multisensor systems replace classic solutions. Measurement performed using the optical system is more vulnerable to incorrect points acquisition due to such factors as an inadequate focus or parameters of applied illumination. This article examines the effect of an increasing illumination on the measurement result. A glass reference plate with marked circles and a hole plate standard were used for the measurements performed on a multi-sensor machine Zeiss O’ Inspect 442. The experiment consisted of measurements of standard objects with different values of the backlight at the maximum magnification. Such approach allows to assess the influence of controlled parameter on errors of diameter and form measurements as well as an uncertainty of measurements by determination of ellipses of point repeatability. The analysis of the obtained results shows that increasing backlight mainly affects the result of the diameter measurement.

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Section: Methodsmentioning

confidence: 99%

Assessment of Background Illumination Influence on Accuracy of Measurements Performed on Optical Coordinate Measuring Machine Equipped with Video Probe

Harmatys

Gąska

et al. 2021

Sensors

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show abstract

“…There are three steps in wafer pre-alignment: edge position acquisitioning, wafer positioning, and wafer calibrating. At present, the methods of obtaining the edge position of the wafer include machine vision recognition [ 4 , 5 , 6 ] and rotary scanning edge recognition [ 7 , 8 , 9 ]. The wafer with a diameter of 300 mm or above is difficult to quickly obtain the edge image with micron-scale accuracy at one time through machine vision due to the limitation of camera resolution and long post-processing time consumption [ 10 ].…”

Section: Introductionmentioning

confidence: 99%

A Wafer Pre-Alignment Algorithm Based on Weighted Fourier Series Fitting of Circles and Least Squares Fitting of Circles

et al. 2023

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The wafer pre-aligner is a crucial component in the lithography process to correct the wafer center and notch orientation. To improve the precision and the efficiency of pre-alignment, a new method to calibrate the center and the orientation of a wafer based on the weighted Fourier series fitting of circles (WFC) method and the least squares fitting of circles (LSC) method, respectively, is proposed. The WFC method effectively suppressed the influence of the outliers and had high stability compared with the LSC method when fitted to the center of the circle. While the weight matrix degenerated to the identity matrix, the WFC method degenerated into the Fourier series fitting of circles (FC) method. The fitting efficiency of the FC method is 28% higher than that of the LSC method, and the fitting accuracy of the center of the FC method is the same as that of the LSC method. In addition, the WFC method and the FC method perform better than the LSC method in radius fitting. The pre-alignment simulation results showed that the absolute position accuracy of the wafer was ±2 µm, the absolute direction accuracy was 0.01°, and the total calculation time was less than 3.3 s in our platform.

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A robust algorithm for rapid pre-alignment of multiple types and sizes of wafers

Tang,

Huang,

Miao

et al. 2024

SIViP

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Online High-Precision Vision Measurement Method for Large-Size Gear Parameters

Cited by 3 publications

References 1 publication

Assessment of Background Illumination Influence on Accuracy of Measurements Performed on Optical Coordinate Measuring Machine Equipped with Video Probe

Assessment of Background Illumination Influence on Accuracy of Measurements Performed on Optical Coordinate Measuring Machine Equipped with Video Probe

A Wafer Pre-Alignment Algorithm Based on Weighted Fourier Series Fitting of Circles and Least Squares Fitting of Circles

A robust algorithm for rapid pre-alignment of multiple types and sizes of wafers

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