Online Calculation of the Increase in Thermal Resistance Caused by Solder Fatigue for IGBT Modules

Hu, Zhi Yi; Du, Mingxing; Wei, Kexin

doi:10.1109/tdmr.2017.2746571

Cited by 64 publications

(15 citation statements)

References 26 publications

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“…When the IGBT module experiences thermal cycling, thermal induced stresses will be produced at both the solder joints within the system and at the interconnection between the silicon chip and the aluminium bond wire. These thermal-mechanical stresses experienced within the IGBT will be responsible for solder-joint fatigue [18] [19] and bond wire lift-off [20] [21], which are the two dominant failure mechanisms experienced within the IGBT module. Information on the number of cycles before either of these failure mechanisms are triggered can be found based on physics of failure model and SCADA data, and as such plays an important role in optimizing the O&M strategy for the power converter of the offshore wind turbine.…”

Section: State-of-the-art Review Summarymentioning

confidence: 99%

Influence of the Mission Profile on The Lifetime Modelling of the Wind Turbine Power Converter – A Review

Simpson

Egea‐Àlvarez

Collu

2020

2020 9th International Conference on Renewable Energy Research and Application (ICRERA)

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Offshore wind energy is currently the leading offshore renewable energy technology and plays an essential role in achieving a low carbon economy in Europe. Offshore wind turbines, as a result of the harsher offshore environment, suffer from high O&M costs, and as such a high overall LCOE. These higher O&M costs can be reduced by focusing on the most critical subassemblies of the OWT, by either improving the reliability of the subassembly or by better understanding the failure mechanism, and thus optimizing the O&M strategy. The power converter is identified as one of the most critical subassemblies as risk of the operation of the OWT in terms of maintainability and availability. The reliability of the power converter is heavily influenced by both its steady-state and its dynamic thermal behavior, and as such great attention will be paid to the literature related to the thermal behaviour of the power converter. This paper seeks to provide a comprehensive overview on how the typical mission profile of an OWT influences the thermal loading. The paper seeks to propose a comprehensive and up-to-date literature review related to the lifetime modelling of the power converter, and to highlight some of the main challenges yet to be tackled in the reliability analysis of the power converter, suggesting future areas of research.

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Section: State-of-the-art Review Summarymentioning

confidence: 99%

Influence of the Mission Profile on The Lifetime Modelling of the Wind Turbine Power Converter – A Review

Simpson

Egea‐Àlvarez

Collu

2020

2020 9th International Conference on Renewable Energy Research and Application (ICRERA)

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“…Since IGBTs are vertical devices, the solders are supposed to provide efficient thermal conduction path and the die-attach solder also provide electrical conduction path additional [3]. The degradation of solder layers causes an increase in junction-to-case thermal resistance R th_jc , reduce the heat dissipation performance of the IGBT module, and raise the junction temperature T j only to result in thermal runaway of IGBT chips finally [5]. So the fatigue phenomena occurring in the solder layers cannot be neglected.…”

Section: Introductionmentioning

confidence: 99%

Impact of Solder Degradation on V _CE of IGBT Module: Experiments and Modeling

Jia

Huang

Xiao

et al. 2022

IEEE J. Emerg. Sel. Topics Power Electron.

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Solder degradation is one of the main packaging failure modes in insulated gate bipolar transistor (IGBT) modules, which is usually evaluated through the change of thermal resistance. However, due to the strong electro-thermal coupling in IGBT module, solder degradation also affects electrical characteristics, such as on-state voltage VCE. The impact mechanism of solder degradation on VCE is analyzed in this paper firstly. For the study of the solder degradation independently, a press-packing setup is designed for the accelerated aging test, which can remove the influence of bond wires degradation and significantly improve the experimental efficiency. Then, the IGBT equivalent resistance is defined, which conforms to Ohm's law in calculation and can respond to the dynamic current in real time. So, it could be conveniently used in the finite element methodbased simulation. Meanwhile, a realistic 3D degradation model of solder layer is constructed by image processing method. Furthermore, an electro-thermal coupling model based on finite element is constructed to study the impact of solder degradation on the electrical and thermal characteristics of IGBT. Finally, the proposed degradation mechanism is verified by simulation and experimental results. Index Terms-Insulated gate bipolar transistor (IGBT), solder degradation, failure modes decoupling, electro-thermal model Impact of Solder Degradation on V CE of IGBT Module: Experiments and Modeling I Manuscript

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“…To cover this defect, [16] proposed to add a variable Rth in series with the TEC of the fresh module to compensate for the baseplate solder fatigue. Also, [17]- [20] all employed a temperature gradient of the baseplate ∇T bp for monitoring of the health status of the baseplate solder. Then, once a change is detected in the gradient, the junction temperature T j gets measured with TSEPs to recalculate total R th from junction to baseplate [17], or to recalculate RC parameters of Foster model for the whole module [18], or to recalculate RC parameters of Cauer model for the baseplate solder and its two adjacent material layers [19].…”

Section: Introductionmentioning

confidence: 99%

“…Also, [17]- [20] all employed a temperature gradient of the baseplate ∇T bp for monitoring of the health status of the baseplate solder. Then, once a change is detected in the gradient, the junction temperature T j gets measured with TSEPs to recalculate total R th from junction to baseplate [17], or to recalculate RC parameters of Foster model for the whole module [18], or to recalculate RC parameters of Cauer model for the baseplate solder and its two adjacent material layers [19]. Furthermore, [20] presented new mathematical relations to recalculate the Cauer model parameters only for the aged chip solder layer.…”

Section: Introductionmentioning

confidence: 99%

An Extended Multilayer Thermal Model for Multichip IGBT Modules Considering Thermal Aging

et al. 2021

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An accurate and real-time knowledge of temperatures in insulated-gate bipolar transistor modules is crucial for reliability analysis and thermal management of power electronic converters. For this purpose, this paper establishes an integrated thermal equivalent circuit model comprising self-heating thermal impedances and cross-heating thermal impedances to provide a temperature profile of the junction and solder joints during various operations and in the case of thermal aging. The thermal resistance and capacitance parameters of the thermal impedances are characterized in terms of different electro-thermal operating conditions and solder joints aging conditions with the help of three-dimensional finite element simulations. Also, the effect of the heatsink, which brings an uneven heat transfer coefficient distribution at the module baseplate, is investigated and modeled into the thermal impedances. The introduced thermal model can work even if the conditions change simultaneously. The accuracy of the model is verified by experiments and finite element simulations, all of which agree with negligible error unlike thermal models given in the datasheet and fixed-parameter thermal models.

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Online Calculation of the Increase in Thermal Resistance Caused by Solder Fatigue for IGBT Modules

Cited by 64 publications

References 26 publications

Influence of the Mission Profile on The Lifetime Modelling of the Wind Turbine Power Converter – A Review

Influence of the Mission Profile on The Lifetime Modelling of the Wind Turbine Power Converter – A Review

Impact of Solder Degradation on V _CE of IGBT Module: Experiments and Modeling

An Extended Multilayer Thermal Model for Multichip IGBT Modules Considering Thermal Aging

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