One-Step Synthesis of Antioxidative Graphene-Wrapped Copper Nanoparticles on Flexible Substrates for Electronic and Electrocatalytic Applications

Tseng, Chi Ang; Chen, Chiao Chen; Ulaganathan, Rajesh Kumar; Lee, Chuan‐Pei; Chiang, Hsiao-Dong; Chang, Chin Fu; Chen, Yit‐Tsong

doi:10.1021/acsami.7b06490

Cited by 22 publications

(23 citation statements)

References 25 publications

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“…Tseng et al. came up with a one‐step synthesis for graphene‐coated Cu NPs that were then used as inks for CVD onto various substrates [117] . Films deposited on PI and silicon (Si) wafers were found to be conductive with ρ =1.70 ×10 −6 Ω m and 1.40×10 −6 Ω m, respectively.…”

Section: Recent Developments In Metal Inksmentioning

confidence: 99%

MODs vs. NPs: Vying for the Future of Printed Electronics

Douglas

Mrig

Knapp

2021

Chemistry A European J

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This Minireview compares two distinct ink types, namely metal-organic decomposition (MOD) and nanoparticle (NP) formulations, for use in the printing of some of the most conductive elements: silver, copper and aluminium. Printing of highly conductive features has found purpose across a broad array of electronics and as processing times and temperatures reduce, the avenues of application expand to low-cost flexible substrates, materials for wearable devices and beyond. Printing techniques such as screen, aerosol jet and inkjet printing are scalable, solutionbased processes that historically have employed NP formula-tions to achieve low resistivity coatings printed at high resolution. Since the turn of the century, the rise in MOD inks has vastly extended the range of potentially applicable compounds that can be printed, whilst simultaneously addressing shelf life and sintering issues. A brief introduction to the field and requirements of an ink will be presented followed by a detailed discussion of a wide array of synthetic routes to both MOD and NP inks. Unindustrialized materials will be discussed, with the challenges and outlook considered for the market leaders: silver and copper, in comparison with the emerging field of aluminium inks.

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Section: Recent Developments In Metal Inksmentioning

confidence: 99%

MODs vs. NPs: Vying for the Future of Printed Electronics

Douglas

Mrig

Knapp

2021

Chemistry A European J

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“…Cu nanoparticles protected by multilayer graphene-encapsulated (MLG-Cu) NPs can protect the Cu cores from oxidation and simultaneously serve as a conductive contact between individual MLG-Cu NPs without the sintering process [ 98 ]. Tseng et al reported a one-step synthesis method to fabricate MLG-Cu NPs with sizes of 52 ± 9 nm directly on various substrates through an expeditious chemical vapor deposition (CVD) [ 99 ]. The electrical resistivity of the pristine MLG-Cu NPs on PI without thermal sintering was measured as 170 μΩ cm, which is ~100-fold lower than in earlier reports.…”

Section: Surface Designs By Surface Protective Layers Against the mentioning

confidence: 99%

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

Tomotoshi

Kawasaki

2020

Nanomaterials

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Silver (Ag), gold (Au), and copper (Cu) have been utilized as metals for fabricating metal-based inks/pastes for printed/flexible electronics. Among them, Cu is the most promising candidate for metal-based inks/pastes. Cu has high intrinsic electrical/thermal conductivity, which is more cost-effective and abundant, as compared to Ag. Moreover, the migration tendency of Cu is less than that of Ag. Thus, recently, Cu-based inks/pastes have gained increasing attention as conductive inks/pastes for printed/flexible electronics. However, the disadvantages of Cu-based inks/pastes are their instability against oxidation under an ambient condition and tendency to form insulating layers of Cu oxide, such as cuprous oxide (Cu2O) and cupric oxide (CuO). The formation of the Cu oxidation causes a low conductivity in sintered Cu films and interferes with the sintering of Cu particles. In this review, we summarize the surface and interface designs for Cu-based conductive inks/pastes, in which the strategies for the oxidation resistance of Cu and low-temperature sintering are applied to produce highly conductive Cu patterns/electrodes on flexible substrates. First, we classify the Cu-based inks/pastes and briefly describe the surface oxidation behaviors of Cu. Next, we describe various surface control approaches for Cu-based inks/pastes to achieve both the oxidation resistance and low-temperature sintering to produce highly conductive Cu patterns/electrodes on flexible substrates. These surface control approaches include surface designs by polymers, small ligands, core-shell structures, and surface activation. Recently developed Cu-based mixed inks/pastes are also described, and the synergy effect in the mixed inks/pastes offers improved performances compared with the single use of each component. Finally, we offer our perspectives on Cu-based inks/pastes for future efforts.

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“…Since the exfoliation of graphene in 2004, 2D-layered materials have caused global research fanaticism based on its unique property [1][2][3][4][5][6][7]. In recent years, the layered transition metal dichalcogenides (TMDs) have been regarded as a hot topic in the research of 2Dlayered materials due to their low cost, abundance, and easy processing [8].…”

Section: Introductionmentioning

confidence: 99%

Active Site Engineering on Two-Dimensional-Layered Transition Metal Dichalcogenides for Electrochemical Energy Applications: A Mini-Review

Chen

Lee

Yang³

et al. 2021

Catalysts

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Two-dimensional-layered transition metal dichalcogenides (2D-layered TMDs) are a chemically diverse class of compounds having variable band gaps and remarkable electrochemical properties, which make them potential materials for applications in the field of electrochemical energy. To date, 2D-layered TMDs have been wildly used in water-splitting systems, dye-sensitized solar cells, supercapacitors, and some catalysis systems, etc., and the pertinent devices exhibit good performances. However, several reports have also indicated that the active sites for catalytic reaction are mainly located on the edge sites of 2D-layered TMDs, and their basal plane shows poor activity toward catalysis reaction. Accordingly, many studies have reported various approaches, namely active-site engineering, to address this issue, including plasma treatment, edge site formation, heteroatom-doping, nano-sized TMD pieces, highly curved structures, and surface modification via nano-sized catalyst decoration, etc. In this article, we provide a short review for the active-site engineering on 2D-layered TMDs and their applications in electrochemical energy. Finally, the future perspectives for 2D-layered TMD catalysts will also be briefly discussed.

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One-Step Synthesis of Antioxidative Graphene-Wrapped Copper Nanoparticles on Flexible Substrates for Electronic and Electrocatalytic Applications

Cited by 22 publications

References 25 publications

MODs vs. NPs: Vying for the Future of Printed Electronics

MODs vs. NPs: Vying for the Future of Printed Electronics

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

Active Site Engineering on Two-Dimensional-Layered Transition Metal Dichalcogenides for Electrochemical Energy Applications: A Mini-Review

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