On the physico-mechanical, electrical and dielectric properties of mullite-glass composites

Andrade, Rivaildo M.; Araújo, Allan J.M.; Alves, Hugo P.A.; Grilo, João P.F.; Dutra, Ricardo Ps.; Campos, L. F. A.; Macedo, Daniel A.

doi:10.1016/j.ceramint.2019.06.070

Cited by 16 publications

(7 citation statements)

References 39 publications

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“…Cordierite and mullite belong to the group of the most popular and cheap ceramic materials characterized by a low dielectric permittivity. Low dielectric permittivity (4.8–6 for cordierite and 6–7.2 for mullite), low dielectric loss, low thermal expansion coefficient and good mechanical strength are the desired properties of these materials in microwave applications [ 6 , 7 , 8 , 9 , 10 , 11 , 12 , 13 , 14 , 15 , 16 , 17 , 18 , 19 , 20 , 21 , 22 , 23 , 24 , 25 , 26 ]. The disadvantage of their high sintering temperatures can be overcome by adding low melting glasses.…”

Section: Introductionmentioning

confidence: 99%

Structural, Thermal and Dielectric Properties of Low Dielectric Permittivity Cordierite-Mullite-Glass Substrates at Terahertz Frequencies

et al. 2021

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Glass–ceramic composites containing cordierite, mullite, SiO2 glass and SiO2-B2O3-Al2O3-BaO-ZrO2 glass were fabricated in a process comprising solid state synthesis, milling, pressing and sintering. Thermal behavior, microstructure, composition and dielectric properties in the Hz-MHz, GHz and THz ranges were examined using a heating microscope, differential thermal analysis, thermogravimetry, scanning electron microscopy, energy dispersive spectroscopy, X-ray diffraction analysis, impedance spectroscopy, transmission method and time domain spectroscopy (TDS). The obtained substrates exhibited a low dielectric permittivity of 4.0–4.8. Spontaneously formed closed porosity dependent on the sintering conditions was considered as a factor that decreased the effective dielectric permittivity.

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Section: Introductionmentioning

confidence: 99%

Structural, Thermal and Dielectric Properties of Low Dielectric Permittivity Cordierite-Mullite-Glass Substrates at Terahertz Frequencies

et al. 2021

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“…Depending on its chemical composition, mullite can be classified as primary and secondary. The primary mullite has an alumina:silica molar ratio of 2:1 (2Al 2 O 3 .SiO 2 ) and 3:2 (3Al 2 O 3 .2SiO 2 ) for the secondary mullite [22,27,28]. The compositional difference is also reflected in its microstructure, which varies from a platelet (ratio of 2:1) to a needle shape (ratio of 3:2) [22].…”

Section: Microstructural Characteristicsmentioning

confidence: 99%

“…Kaolinite and other clay minerals have been widely used as raw materials since they allow various component shaping procedures, have low cost, are abundant in nature, and result in a simple method of producing mullite [2,8,[60][61][62]. The raw materials, regardless of their method of preparation, may follow two routes of mullitization: the direct formation of mullite at temperatures of approximately 900 and 1000 ºC, which occurs when Al 2 O 3 and SiO 2 are mixed at the molecular level, and the formation of mullite above 1200 ºC, when Al 2 O 3 and SiO 2 are mixed in the level of particles [28,62]. In addition, the development of mullite depends on the type of precursor, the particle size, the method of combining the reagents, and the heat treatment.…”

Section: Synthesismentioning

confidence: 99%

Microstructural characteristics, properties, synthesis and applications of mullite: a review

et al. 2022

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Mullite, an intermediate phase of the binary alumina-silica system, is one of the most important phases of ceramic products containing alumina and silica in the initial composition. Its stoichiometry ranges from 3Al 2 O 3 .2SiO 2 (3:2) to 2Al 2 O 3 .SiO 2 (2:1) and its crystalline structure is orthorhombic, characterized by the presence of octahedral chains of AlO 6 interconnected by tetrahedral chains of aluminum-oxygen and/or silicon-oxygen (AlO 4 /SiO 4 ). Properties such as high chemical and thermal stability, low thermal expansion and conductivity, and good mechanical strength enable a wide range of applications. Due to the relevance of this material, it is important for the scientific community to understand its microstructural characteristics, properties, methods of synthesis, and various applications. Therefore, this article aimed to make a comprehensive review on the mullite to gather and present to the reader a series of relevant information that makes it possible to deepen the knowledge about mullite.

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“…Mullite (3Al 2 O 3 •2SiO 2 ) is well-known for its ability to enhance the mechanical properties of cordierite [7,15,16], but it is also used in electronic substrates, microelectronic packaging, and as a component in reinforced composites due to its high electrical resistance, thermal shock resistance, excellent thermal and chemical stability at elevated temperatures, and good dielectric and mechanical properties [16][17][18][19]. Albhilil et al [10] reported that although the TEC increases slightly with the addition of mullite, the relatively low mechanical strength of cordierite can be improved through polymorphism transformation.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of Large-Area Mullite–Cordierite Composite Substrates for Semiconductor Probe Cards and Enhancement of Their Reliability

et al. 2022

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This work aims to fabricate a large-area ceramic substrate for the application of probe cards. Mullite (M) and cordierite (C), which both have a low thermal expansion coefficient, excellent resistance to thermal shock, and high durability, were selected as starting powders. The mullite–cordierite composites were produced through different composition ratios of starting powders (M:C = 100:0, M:C = 90:10, M:C = 70:30, M:C = 50:50, M:C = 30:70, and M:C = 0:100). The effects of composition ratio and sintering temperature on the density, porosity, thermal expansion coefficient, and flexural strength of the mullite–cordierite composite pellets were investigated. The results showed that the mullite–cordierite composite pellet containing 70 wt% mullite and 30 wt% cordierite sintered at 1350 °C performed exceptionally well. Based on these findings, a large-area mullite–cordierite composite substrate with a diameter of 320 mm for use in semiconductor probe cards was successfully fabricated. Additionally, the changes in sheet resistance and flexural strength were measured to determine the effect of the environmental tests on the large-area substrate such as damp heat and thermal shock. The results indicated that the mullite–cordierite composite substrate was extremely reliable and durable.

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On the physico-mechanical, electrical and dielectric properties of mullite-glass composites

Cited by 16 publications

References 39 publications

Structural, Thermal and Dielectric Properties of Low Dielectric Permittivity Cordierite-Mullite-Glass Substrates at Terahertz Frequencies

Structural, Thermal and Dielectric Properties of Low Dielectric Permittivity Cordierite-Mullite-Glass Substrates at Terahertz Frequencies

Microstructural characteristics, properties, synthesis and applications of mullite: a review

Fabrication of Large-Area Mullite–Cordierite Composite Substrates for Semiconductor Probe Cards and Enhancement of Their Reliability

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