On the fracture of multi-crystalline silicon wafer

Zhao, Lv; Nélias, Daniel; Bardel, Didier; Maynadier, Anne; Chaudet, Philippe; Marie, B.

doi:10.1088/0022-3727/49/47/475601

Cited by 13 publications

(3 citation statements)

References 42 publications

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“…This can be assimilated to a grain boundary crossing. Previous studies have shown that when a crack switches from one grain to the adjacent one, the misorientation between the two cleavage planes toughens the plane ahead the grain boundary [25]. In this sense, if the deflection is instant or very short, the (110) plane will become no longer favorable since it is toughened due to a rotation of…”

Section: Discussionmentioning

confidence: 99%

Disturbance and recovery in high speed (110) cleavage in single crystalline silicon

Zhao

Wang

Maynadier

et al. 2018

Journal of the European Ceramic Society

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Stress perturbations and material defects can significantly affect the fracture initiation and propagation behaviors in brittle materials. In this work, we show that (110) [110] cleavage in silicon deflects onto (111) plane in the presence of contact stresses. The deflection is however not permanent as the crack returns to the (110) plane after a certain length of propagation, even in the case where the crack velocity is up to 78% of the Rayleigh wave speed. The recovery behavior indicates that the (110) [110] cleavage is invariably prevailing when perpendicular to the maximum stress. Following this indication, it can be concluded that the observed (110) [110]-(111) deflection in previous literature is most likely driven by the external disturbance rather than the crack velocity induced toughness evolution. We also highlight that the extra energy for the (110) recovery is minimized at the expense of a large propagation distance upon the plane switch.

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Section: Discussionmentioning

confidence: 99%

Disturbance and recovery in high speed (110) cleavage in single crystalline silicon

Zhao

Wang

Maynadier

et al. 2018

Journal of the European Ceramic Society

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“…Several methods are developed to model crack propagation, which can be divided into two groups according to the representation of cracks: discrete, such as cohesive surfaces [2] and X-FEM [3,4,5] or diffuse, such as non-local approaches [6] or phase field method [7], among others.…”

Section: Introductionmentioning

confidence: 99%

Effect of microstructural length scales on crack propagation in elastic Cosserat media

Riad

Bardel²,

Réthoré

2022

Engineering Fracture Mechanics

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“…Many numerical models have been developed to study fracture for polycrystalline materials ( [4], [5], [6]). Recently, the phase field model has proven to be a powerful tool to simulate complex cracking phenomena ( [7], [8]).…”

Section: Introductionmentioning

confidence: 99%

Unified phase field model to simulate both intergranular and transgranular failure in polycrystalline aggregates

Riad

Bardel²,

Réthoré

2021

Finite Elements in Analysis and Design

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In this work we develop a new phase field method for modeling fracture in polycrystalline materials. Many studies addressed this problem by combining cohesive models at the grain boundaries and damage models for the bulk. In this paper, a unified formulation is proposed in the phase field framework. Anisotropic failure is considered within the grain. Each of the preferential failure direction is associated with a damage variable. An additional damage variable is dedicated to the grain boundaries which are considered of finite thickness. Furthermore the value of the fracture energy at the grain boundaries is set depending on the local misorientation. The obtained model allows modeling competition and interactions between intergranular and transgranular fracture. The proposed model is illustrated through several numerical examples including crack initiation and propagation in polycrystalline aggregates.

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On the fracture of multi-crystalline silicon wafer

Cited by 13 publications

References 42 publications

Disturbance and recovery in high speed (110) cleavage in single crystalline silicon

Disturbance and recovery in high speed (110) cleavage in single crystalline silicon

Effect of microstructural length scales on crack propagation in elastic Cosserat media

Unified phase field model to simulate both intergranular and transgranular failure in polycrystalline aggregates

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