Abstract:Stress perturbations and material defects can significantly affect the fracture initiation and propagation behaviors in brittle materials. In this work, we show that (110) [110] cleavage in silicon deflects onto (111) plane in the presence of contact stresses. The deflection is however not permanent as the crack returns to the (110) plane after a certain length of propagation, even in the case where the crack velocity is up to 78% of the Rayleigh wave speed. The recovery behavior indicates that the (110) [110]… Show more
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