2012
DOI: 10.1002/pip.2167
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On the determination of the emitter saturation current density from lifetime measurements of silicon devices

Abstract: Contactless photoconductance measurements are commonly used to extract the emitter saturation current density (Joe) for crystalline silicon samples containing an emitter on the surface. We review the physics behind the analysis of Joe and compare the commonly used approximations with more generalised solutions using two‐dimensional device simulations. We quantify errors present in such approximations for different test conditions involving varying illumination conditions and surface properties in samples with … Show more

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Cited by 56 publications
(34 citation statements)
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“…For the simulations, we solve the full set of semiconductor equations and use independently measured device properties according to [17]. The excess charge carrier density above the contact area is averaged over the sample thickness at different illumination levels, and the J 0 value of the contacted area is calculated according to (1).…”
Section: Resultsmentioning
confidence: 99%
“…For the simulations, we solve the full set of semiconductor equations and use independently measured device properties according to [17]. The excess charge carrier density above the contact area is averaged over the sample thickness at different illumination levels, and the J 0 value of the contacted area is calculated according to (1).…”
Section: Resultsmentioning
confidence: 99%
“…As Auger recombination has a large contribution to the resulting emitter saturation current density J 0e , different Auger parameterization models will result in different J 0e values. 20,38 The commonly accepted Auger parameterization model by Kerr and Cuevas 39 was used in this work. Besides that the measured ECV doping profile and Q f of the Al 2 O 3 film were also used in the simulations.…”
Section: B the Impact Of Auger And Surface Recombination On J 0ementioning
confidence: 99%
“…For the exact comparison with recombination, more experimental results are required, which specifically focus on contact size. However, most of the optimization of contact sizes are done at wafer level, that is, by processing of wafer for sheet resistance measurement [25], lifetime measurement [50], and transfer length measurement [51]. But these measurements do not relate contact sizes with cell parameters.…”
Section: Discussionmentioning
confidence: 99%