2007
DOI: 10.1007/s10704-007-9070-9
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On Stress Intensity Factors of Multiple Cracks at Small Distances in 2-D Problems

Abstract: In the present work a method is proposed to predict stress intensity factors (SIFs) of strongly interacting cracks at spacings that are substantially smaller than crack lengths. The method is intended for applications where cracks are observed in stack-like/staggered arrangements as in damage patterns of some natural materials with dense lamellar microstructures. The new calculation procedure is inspired by the analytical method of Kachanov (1987) that due to its simplicity has shown to be a powerful tool for … Show more

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Cited by 12 publications
(5 citation statements)
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“…Kachanov (1987) has defined a simple model based on this approximation and both his results and those of other researchers (Basista and Gross, 2000;Li et al, 2003;Gorbatikh et al, 2007) demonstrate that the predictions are quite accurate except in cases where the cracks are extremely close together.…”
Section: Introductionmentioning
confidence: 81%
“…Kachanov (1987) has defined a simple model based on this approximation and both his results and those of other researchers (Basista and Gross, 2000;Li et al, 2003;Gorbatikh et al, 2007) demonstrate that the predictions are quite accurate except in cases where the cracks are extremely close together.…”
Section: Introductionmentioning
confidence: 81%
“…, Das , Kobayashi and Moss , Rose , Senddon and Lowengrub , Nisitani and Murakami ), where KI* and KII* are the stress intensity factors of mode II crack situated at the interface of two half planes in the absence of sub‐interfacial crack and these are given by Das et al. as KI*=p,KII*=pπb1c1a1d1ln1+a1b1c1d11a1b1c1d1where p1(x)=p and p2(x)=0.…”
Section: Solution Of the Integral Equationsmentioning
confidence: 99%
“…Finally, the stress intensity factors at the tips of the crack at y = 0 are given by [26]), where K * I and K * I I are the stress intensity factors of mode II crack situated at the interface of two half planes in the absence of sub-interfacial crack and these are given by Das et al [7] as…”
Section: Solution Of the Integral Equationsmentioning
confidence: 99%
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