2013 IEEE MTT-S International Microwave Symposium Digest (MTT) 2013
DOI: 10.1109/mwsym.2013.6697451
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On-orbit verification of an LTCC double flip-chip packaging concept in an S-/K-band satellite transponder

Sascha Brosius
1
,
Christian Friesicke
2
,
T. Baras3
et al.
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Fully Qualified Gallium Nitride Power Amplifier for Use in Ka-Band Commercial Space Applications

Mok,
Chiang,
Law
et al. 2023
2023 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)
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Fully Qualified Gallium Nitride Power Amplifier for Use in Ka-Band Commercial Space Applications

Mok,
Chiang,
Law
et al. 2023
2023 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)
1
0
0
0
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K-band SATCOM Receiver Modules: System Design, Analysis and Test using the M3-Approach

Tschoban
1
,
Curran
2
,
Reyes
3
et al. 2018
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)
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Verification of a Chinese Copper-system LTCC

Yang,
Sun,
Xu
et al. 2023
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
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