On 3-D IC design for test

Cheng, Karl

doi:10.1109/impact.2010.5699538

Cited by 4 publications

(1 citation statement)

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“…According to the drilling machine and the borehole trajectory, the theoretical loads of the drill pipe tool joint are obtained. Considering the extreme conditions in the hole, the theoretical load was multiplied by a safety factor [27] of 1.2. Tension, bending, and torque loads are applied to the coupling point, as shown in Table 1.…”

Section: Materials Parameters and Meshmentioning

confidence: 99%

Numerical Analysis of the Stress Distribution and Concentration Factors of the Tool Joint of the Directional Drill Pipe

Shu

Zhao

Mei

et al. 2023

Mathematical Problems in Engineering

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With the wide application of directional drilling technology in coal mine predraining boreholes, the failure problem of the tool joint of the directional drill pipe has become one of the main factors restricting the drilling efficiency. The main reason for the failure problem of the tool joint of the directional drill pipe is the stress concentration. The stress test rig for the tool joint of the directional drill pipe is designed based on the resistance strain measurement method, and the stress of the tool joint of the directional drill pipe is tested. The tool joint’s 3D finite element model was established based on nonlinear contact theory. The experiment verified the accuracy of this model. The stress distribution of the tool joint of the directional drill pipe was obtained. The research shows that the stress of the tool joint of the directional drill pipe is concentrated at the root between the third and the fourth turn of the engaged thread. The work presented in this study is a reliable guide to the design and field use of the tool joint of the directional drill pipe.

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Section: Materials Parameters and Meshmentioning

confidence: 99%

Numerical Analysis of the Stress Distribution and Concentration Factors of the Tool Joint of the Directional Drill Pipe

Shu

Zhao

Mei

et al. 2023

Mathematical Problems in Engineering

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The 3-D parallel processor applied to matrix multiplication

Cheng¹,

Cheng²

2013

2013 E-Manufacturing &Amp; Design Collaboration Symposium (eMDC)

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Micro bridge technology for 3D-IC interconnection could benefit the 3D-IC test strategy

Cheng

Yang

Cheng³

et al. 2012

2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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Performing electrical test is the most challenge process in the 3D-IC device fabrication and manufacturing. There have been many papers published and presented for 3D-IC device testing technology such as 3D-IC design for test, test for less in the 3D-IC manufacturing etc... Most of them are circuit design related techniques. In this paper we will discuss a different point of view in the device packaging technologies that may affect the cost of testing.The main technologies for integrating and fabricating the 3D-IC device and system are (1) Through Silicon Via (TSV) technology for vertical communication;(2) interconnecting technology to accomplish the up and down signal flow between wafer layers and (3) stacking technology to complete the final assembly of the 3D-IC device and system. One very important step in the integration and manufacturing process is the testing and evaluating of the 3D-IC stacked system. This paper will dedicate to the issue of choosing the right interconnecting technology for cost effective consideration by introducing the Micro Bridge Technology. With the right choice of interconnecting technology, we will be benefited from the reduction of the 3D-IC system integration and testing through both cost and complexity. CURRENT 3D-IC INTERCONNECTING TECHNOLOGIESA lot of researches have been dedicated to the 3D-IC interconnecting technology. Among them the 3 kinds of interconnection technology are the most popular ones. They are (1) Interposer (with silicon or glass or membrane substrate) (2) Microbump and (3) Micro-Bridge. The advantages of using the Microbridge as the interconnection are (1) to compensate for warping of the wafer surface introduced during the circuit fabrication processing and (2) the stack can be disassembled and the individual wafers or silicon substrates can be demounted for re-test and/or replacement.

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On 3-D IC design for test

Cited by 4 publications

References 0 publications

Numerical Analysis of the Stress Distribution and Concentration Factors of the Tool Joint of the Directional Drill Pipe

Numerical Analysis of the Stress Distribution and Concentration Factors of the Tool Joint of the Directional Drill Pipe

The 3-D parallel processor applied to matrix multiplication

Micro bridge technology for 3D-IC interconnection could benefit the 3D-IC test strategy

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