OASIS: cryogenically-optimized resistive arrays and IRSP subsystems for space-background IR simulation

Abstract

SBIR has completed design and development of prototype emitter arrays and is completing custom cryogenic vacuum device packaging and support electronics for the Optimized Arrays for Space-background Infrared Simulation (OASIS) program. The OASIS array is a 512 x 512 device featuring high output dynamic range, a selectable analog/digital scene data interface, and the capability to operate from cryogenic to ambient substrate temperatures -thereby providing an enabling technology for projection of simulated radiance of space-background scenes. Prototype emitter production has been completed at RTI International in support of initial deliveries. The OASIS array package incorporates novel electrical bussing schemes optimized for the OASIS RIIC and a modular architecture to allow user re-configuration of both window and emitter shield. The OASIS package leverages LFRA operation features, and supports both ambient and cryogenic chamber-based operation with a minimum of mechanical and electrical re-configuration. The OASIS close support electronics (CSE) supports both analog and digital input data modes, while providing easy electronic connection between arrays installed in the cryogenic chamber and the external control and scene-generation systems. We present a technical overview of the OASIS array/package and CSE designs, and will report on measured radiometric performance from prototype OASIS arrays.

Scalable emitter array development for infrared scene projector systems

“…Numerous copies of each RIIC die could be placed on a standard 200mm wafer, and yield was typically around 75%. Larger format arrays, such as the SBIR MIRAGE-XL and OASIS 1024 [4] arrays with RIICs about 2 inches (5cm) on a side, had substantially lower yield, averaging around 15%. The yield curve projects the cost of the RIIC to be extremely exorbitant and may in fact yield zero at 2048x2048 pixels or larger array size (see Table 1).…”

“…The other driving force in the chip carrier design will be the need to support cryogenic operation of the emitter array. The chip carrier will need to be designed to survive the rigors of cryogenic operation much like the OASIS [4] chip carrier designed by SBIR.…”

Ultrahigh-temperature emitter pixel development for scene projectors

“…The Ultra High Temperature (UHT) [1] Infrared Scene Projector (IRSP) program is developing new pixels that can reach the high apparent temperature needs of today's test applications. The technology used to produce the emitter array as well as the drive electronics were leveraged from the existing MIRAGE XL [2] and OASIS 1024 [3] Infrared Scene Projection Systems. These new materials and pixels were developed with RTI International under the Ultra High Temperature program.…”

A micro-mirror modulator for infrared simulation modeling stands

“…Ключевыми элементами этих стендов являются генераторы инфра-красных изображений, обеспечивающие формирование как тестовых изобра-жений, так и реальных динамических сцен [3]. В настоящее время наиболее распространенными в стендах динамической генерации ИК сцен являются тепловые источники излучения [4][5][6][7][8], которые пригодны для генерации сцен, моделирующих тела с равномерной излучающей способностью. Однако при моделировании излучающего тела необходимо задавать как яркость излуче-ния поверхностей, так и его спектральный состав [9,10].…”