Scalable emitter array development for infrared scene projector systems

Abstract

Several new technologies have been developed over recent years that make a fundamental change in the scene projection for infrared hardware in the loop test. Namely many of the innovations are in Read In Integrated Circuit (RIIC) architecture, which can lead to an operational and cost effective solution for producing large emitter arrays based on the assembly of smaller sub-arrays. Array sizes of 2048x2048 and larger are required to meet the high fidelity test needs of today's modern infrared sensors. The Test Resource Management Center (TRMC) Test and Evaluation/Science & Technology (T&E/S&T) Program through the U.S. Army Program Executive Office for Simulation, Training and Instrumentations (PEO STRI) has contracted with SBIR and its partners to investigate integrating new technologies in order to achieve array sizes much larger than are available today. SBIR and its partners have undertaken several proof-of-concept experiments that provide the groundwork for producing a tiled emitter array. Herein we will report on the results of these experiments, including the demonstration of edge connections formed between different ICs with a gap of less than 10µm.

Development of an ultra-high temperature infrared scene projector at Santa Barbara Infrared Inc.

“…[3] This study determined the optimum design approach for creating a RIIC that would support both high frame rates and high spatial resolution. It identified quilt packaging as the optimum method for producing very large arrays that could run at high frame rates.…”