2012
DOI: 10.1016/j.jmatprotec.2011.10.028
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Numerical study on the evolution of surface defects in wire drawing

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Cited by 25 publications
(7 citation statements)
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“…In the multi-pass wire drawing process, the crack width decreased because of the circumferential compression in the drawing die. In addition, the crack size increased in the axial direction, and the crack depth gradually deceased [21,22]. This means that if the crack size and depth of the initial wire are less than the critical value, the crack can be eliminated.…”
Section: Resultsmentioning
confidence: 99%
“…In the multi-pass wire drawing process, the crack width decreased because of the circumferential compression in the drawing die. In addition, the crack size increased in the axial direction, and the crack depth gradually deceased [21,22]. This means that if the crack size and depth of the initial wire are less than the critical value, the crack can be eliminated.…”
Section: Resultsmentioning
confidence: 99%
“…The directions of the surface flaws on the OT wire were classified into longitudinal, transverse, and oblique directions concerning the axial direction of the wire, as shown in Fig. 8 11 . The influence of the surface flaw direction on the spring strength was evaluated via FE analysis.…”
Section: Standardization Of Surface Flaws In the Ot Wirementioning
confidence: 99%
“…and material properties. The formation of defects during the drawing process has been studied for both surface (Baek, 2012; Phelan, 2001a) as well as internal defects (Camacho, 2006; Phelan, 2001b). Internal defects produced in the drawing process are difficult to observe and can cause fracture during the process (Orbegozo, 1968), so numerical modelling incorporating damage models has proven to be a powerful tool for predicting fracture in wire drawing (Cao, 2015; Ko and Kim, 2000; McAllen and Phelan, 2007; González et al., 2018; among others).…”
Section: Introductionmentioning
confidence: 99%