Fabrication of 50.0 μm Ultra-Fine Pure Rhodium Wire, Using a Multi-Pass Wire Drawing Process, for Probe Card Pins

Abstract

Rhodium is a rare material that is widely used in electrical and electronic components due to its excellent mechanical and electrical properties. Ultra-fine rhodium wires in particular are widely used in electronic components. In this study, a multi-pass wire drawing process was designed to fabricate ultra-fine pure rhodium wire with a diameter of 50.0 µm from an initial diameter of 80.0 µm, which is used as probe card pins. An elastic–plastic finite element (FE) analysis was performed to validate the pass schedule that was designed for this study. A fine wire drawing experiment was also carried out to verify the effectiveness of the designed process. As a result, the ultra-fine rhodium wire was fabricated using the design process without wire breaks and the diameter of the final drawn wire was 47.80 µm.

The influences of the variable speed and internal die geometry on the performance of two commercial soluble oils in the drawing process of pure copper fine wire

“…It should be noted that many of the previous works consulted are mainly focused on the study of the influence of the geometrical parameters involved in the process [18][19][20][21] and some of them on the objective directed to the optimization of the multi-stage drawing processes in terms of the die geometry and the number of passes to be carried out in the in-line wiredrawing process [22][23][24]. Although some of these works describe the use of emulsions based on soluble oils as a common solution in the wiredrawing process of non-ferrous metals and alloys and implement the friction coefficient (µ) for the process analysis, none of them have defined and experimentally studied their own tribological system in order to determine the best conditions for the best optimization of this key parameter.…”

Fine Electrolytic Tough Pitch Copper Multistage Wiredrawing Pass Schedule Design by Analytical and Numerical Methods

“…Fine wire is manufactured with metals such as stainless steel, gold, magnesium, tungsten, rhodium and copper by a sequential multi-pass wiredrawing process [1][2][3][4][5][6]. Copper fine wires have a wide range of applications as semiconductors and bonding wire in electronics, medical devices, shielding applications or measurement sensors, as is shown in Figure 1.…”

“…Computer-aided numerical simulation of the wiredrawing process offers great potential in the sense of analysis and design of this type of process and previous works consulted [1,2,20], which demonstrated its viability for implementation in the case of multi-step wiredrawing case. The finite element method (FEM) has been implemented successfully in many previous research works consulted [5,[21][22][23][24].…”