Numerical study on the de-molding behavior of 2D PMMA nanochannles during hot embossing process

Yin, Zhifu; Sun, Lei; Cheng, E; Zou, Helin

doi:10.1007/s00542-014-2358-6

Cited by 6 publications

(4 citation statements)

References 21 publications

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“…Lee et al [ 14 ] obtained a numerical viscoelastic material model for polycarbonate (PC) and simulated the micro-thermal-imprinting process using PC near the glass transition temperature (T g ) using the FEA method. Zou et al simulated the de-molding behavior of nanochannels during hot embossing process based on FEM [ 15 ]. To understand the behavior of the imprint polymer under low-temperature nanoimprinting, FEM simulations of thin polymer films squeezing into stamp cavities were performed by Sin et al during NIL with a temperature range T g < T < T g + 40 °C using a two-dimensional viscoelastic model [ 16 ].…”

Section: Introductionmentioning

confidence: 99%

High Aspect Ratio Nanoimprint Mold-Cavity Filling and Stress Simulation Based on Finite-Element Analysis

2017

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High aspect ratio three-dimensional micro- and nanopatterns have important applications in diverse fields. However, fabricating these structures by a nanoimprinting method invites problems like collapse, dislocation, and defects. Finite-element analysis (FEA) is a good approach to help understand the filling process and stress distribution. The FEA method was employed to simulate the nanoimprinting process using positive and negative molds with aspect ratios of 1:1, 3:1, 5:1, and 7:1. During the filling process, the resist adjacent to boundaries has the maximum displacement. The corners of contact areas between the protruding part of the mold and the resist has the maximum Von Mises stress. For both positive and negative molds, the maximum stress in the mold increases with aspect ratio. However, filling up negative molds is more difficult than positive ones. With the same aspect ratio, the maximum stress in a negative mold is approximately twice as large as that in a positive one.

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Section: Introductionmentioning

confidence: 99%

High Aspect Ratio Nanoimprint Mold-Cavity Filling and Stress Simulation Based on Finite-Element Analysis

2017

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Section: Fabrication Of Micro and Nanoscale Devicesmentioning

confidence: 99%

“…[227] This technique includes heating a mold and polymer sheet to glass transition temperature (T g ) of the polymer, pressing a mold into the polymer to emboss the mold pattern into the polymer at the constant T g temperature, and reducing the temperature for demolding. [228] Soft lithography is another useful technique to create micro and nanofabrication on surfaces using elastomeric materials. Preparing microfluidic devices using soft lithography technique is low-cost and straightforward.…”

Section: Fabrication Of Micro and Nanoscale Devicesmentioning

confidence: 99%

Micro and Nanoscale Technologies for Diagnosis of Viral Infections

Nasrollahi

Haghniaz

Hosseini

et al. 2021

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Viral infection is one of the leading causes of mortality worldwide. The growth of globalization significantly increases the risk of virus spreading, making it a global threat to future public health. In particular, the ongoing coronavirus disease 2019 (COVID‐19) pandemic outbreak emphasizes the importance of devices and methods for rapid, sensitive, and cost‐effective diagnosis of viral infections in the early stages by which their quick and global spread can be controlled. Micro and nanoscale technologies have attracted tremendous attention in recent years for a variety of medical and biological applications, especially in developing diagnostic platforms for rapid and accurate detection of viral diseases. This review addresses advances of microneedles, microchip‐based integrated platforms, and nano‐ and microparticles for sampling, sample processing, enrichment, amplification, and detection of viral particles and antigens related to the diagnosis of viral diseases. Additionally, methods for the fabrication of microchip‐based devices and commercially used devices are described. Finally, challenges and prospects on the development of micro and nanotechnologies for the early diagnosis of viral diseases are highlighted.

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“…Applying proper pressure and temperature is crucial in hot embossing technique because otherwise some defects such as fluid leakage, channel deformation and/or blocking and so on may occur [21]. Sometimes, during demolding steps of hot embossing, channels can be distorted by forces such as friction and cohesion [22][23][24].…”

Section: Introductionmentioning

confidence: 99%

Temperature and pressure effects on microchannels dimensions in hot embossing

Koochaksaraei¹,

Ahmadi²,

Hajian³

et al. 2022

J. Micromech. Microeng.

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Hot embossing is a microfabrication technique for making microchannels and microfluidic devices. Temperature and pressure along with the material thermos-mechanical properties are the key parameters in controlling the shape of embossed channels. In this paper, experimental and numerical investigations of pressure and temperature effects on channel dimensions are presented. The material used as workpieces is poly methyl methacrylate (PMMA). The depth, upper width and lower width are the main dimensions of microchannel which are studied in this work. Experiments were performed at temperatures of 140, 150, 160, 170 and 180℃ and pressures of 235kPa, 295kPa and 340kPa. Numerical and experimental results show a good agreement, i.e. 6.7% difference in dimensional length in the worst case and less than 0.3% in the best case. Based on width and depth values obtained via both experiments and simulations an optimum condition of temperature and pressure is presented in this paper for forming of microchannel on PMMA. Based on performed experiments, 150°C with 295kPa is found to be the nearest condition to the optimum point.

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Numerical study on the de-molding behavior of 2D PMMA nanochannles during hot embossing process

Cited by 6 publications

References 21 publications

High Aspect Ratio Nanoimprint Mold-Cavity Filling and Stress Simulation Based on Finite-Element Analysis

High Aspect Ratio Nanoimprint Mold-Cavity Filling and Stress Simulation Based on Finite-Element Analysis

Micro and Nanoscale Technologies for Diagnosis of Viral Infections

Temperature and pressure effects on microchannels dimensions in hot embossing

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