2009
DOI: 10.1016/j.cryogenics.2008.10.004
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Numerical study of cryogenic micro-slush particle production using a two-fluid nozzle

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Cited by 13 publications
(15 citation statements)
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“…They also were investigated the choking phenomenon with high Mach number. Both experimental and numerical work of the microslush jet of a two-fluid nozzle were analyzed and examined by Ishimoto [3]. The atomization and flow characteristics were studied using micro-slush nitrogen particles in a two-fluid nozzle.…”
Section: Introductionmentioning
confidence: 99%
“…They also were investigated the choking phenomenon with high Mach number. Both experimental and numerical work of the microslush jet of a two-fluid nozzle were analyzed and examined by Ishimoto [3]. The atomization and flow characteristics were studied using micro-slush nitrogen particles in a two-fluid nozzle.…”
Section: Introductionmentioning
confidence: 99%
“…In the present study, the innovative characteristics of the cryogenic single-component micro solid nitrogen (SN 2 ) particle production using a Laval nozzle and its application to the physical resist removal-cleaning process were investigated by a measurement-coupled computational technique. In the conventional method for solid nitrogen particle generation proposed by the authors [5], the use of cryogenic helium gas was required as a refrigerant. However, since helium is very expensive due to being specified as a strategic material and its rarity, there is a serious problem of cost for its use in the cleaning process.…”
Section: Application Of Micro-sn 2 Spray To Semiconductor Wafer Cleanmentioning
confidence: 99%
“…Photo resist can be removed and cleaned from the wafer surface due to the interaction of the particle impingement of inertial forces and the rapid thermal contraction effect (thermomechanical effect of the resist), which is based on the ultra-high heat flux cooling effect of the inherent characteristics of cryogenic solid particles which accompany phase change. In our previous research [5], the macroscopic thermal characteristics of solid nitrogen (SN 2 ) spray cooling performance was partially clarified. However, microscopic heat transfer and hydrodynamic behavior of a single cryogenic SN 2 particle impinging on a heated substrate have not been sufficiently investigated.…”
Section: Introductionmentioning
confidence: 99%
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“…Thus, the application of a fine solid nitrogen spray for physical semiconductor cleaning methods without the use of water would be very useful. Therefore, the application of cryogenic high-speed spray of micro-solid nitrogen 15 (SN 2 ) to resist-removal and a semiconductor wafer ultra-cleaning system is the focus of great interest. In order to effectively apply the use of the high-performance of such cryogenic solid particles in the field of advanced nano technology, our laboratory has developed a new physical semiconductor cleaning method using cryogenic spray.…”
mentioning
confidence: 99%