2010
DOI: 10.1016/j.msea.2010.04.010
|View full text |Cite
|
Sign up to set email alerts
|

Numerical simulations of void growth in aluminum alloy AA5083 during elevated temperature deformation

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1
1

Citation Types

0
4
0

Year Published

2011
2011
2024
2024

Publication Types

Select...
7

Relationship

0
7

Authors

Journals

citations
Cited by 13 publications
(4 citation statements)
references
References 48 publications
0
4
0
Order By: Relevance
“…However, most of the constitutive equations that describe the material behaviour are empirical models, in which all the material constants were determined from macro-scale experiments only. More detailed constitutive models to account for damage or microstructure evolution [11] are therefore needed, by which it is possible to enable an appropriate description of the material behaviour during plastic flow [12]. A physical-based model is suggested to give a better description in some respects of coupling to intrinsic variables and different deformation mechanisms that can fix a large range of applications with temperature and strain rate dependence.…”
Section: Introductionmentioning
confidence: 99%
“…However, most of the constitutive equations that describe the material behaviour are empirical models, in which all the material constants were determined from macro-scale experiments only. More detailed constitutive models to account for damage or microstructure evolution [11] are therefore needed, by which it is possible to enable an appropriate description of the material behaviour during plastic flow [12]. A physical-based model is suggested to give a better description in some respects of coupling to intrinsic variables and different deformation mechanisms that can fix a large range of applications with temperature and strain rate dependence.…”
Section: Introductionmentioning
confidence: 99%
“…This implies that diffusion does not contribute to the cavitation behavior. According to Du et al's prediction [24], the fraction of void growth through SDC, GBS and grain boundary diffusion is roughly 0.65, 0.3 and 0.05, respectively. It is therefore reasonable to assume that GBS-controlled deformation occurring in a complementary manner may also cause some damage along grain boundaries.…”
Section: Overall Growth Behaviormentioning
confidence: 95%
“…As the grain boundaries slide during deformation, space is created in the grain boundary and grain triple junction. These spaces appear as cavities with complex shapes as shown in Figure 11 [30,33]. For this reason, the cavities were observed at grain boundaries and grain triple junctions in the microstructure of the 400 °C and 0.001 s −1 condition.…”
Section: Cavitiesmentioning
confidence: 99%
“…Through the etched microstructure image of the 400 • C and 0.001 s −1 condition shown in Figure 11, it can be seen that the cavities with complex shape were distributed at the grain boundary and grain triple junction. It is known that cavities arranged in a row are caused by the concentration of stress around particles lying along the rolling direction [29,30]. On the other hand, cavities with complex shape appeared due to a different reason.…”
Section: Metallurgical Evolutionmentioning
confidence: 99%