Abstract:A three-dimensional (3D) thermo-elastic stress model based on the displacement method was developed to study the thermal stress distribution in the solidified silicon ingot in a directional solidification process. The temperature field was obtained from a 3D global simulation of heat transfer in the furnace. A new coupled model was developed to account for the interaction between the silicon ingot and the quartz crucible. The thermal stresses and deformations of the ingot and the crucible were solved simultane… Show more
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