Numerical Simulation of Reflow Soldering

Stadler, Michael

doi:10.1109/eurosime.2019.8724550

Cited by 5 publications

(5 citation statements)

References 5 publications

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“…In this research work, a simplistic simulation method was attempted to develop by which we can predict the intermetallic compounds formation in diffusion soldering process [17] in the solder-substrate interface as well as the thickness of those phases with a specific time-dependent temperature profile. For the simplicity of the design of the simulation method, solder and substrate material is chosen as pure tin (Sn) and copper (Cu) in this study.…”

Section: Resultsmentioning

confidence: 99%

Development of a Simplistic Method to Simulate the Formation of Intermetallic Compounds in Diffusion Soldering Process

Chaki¹

2019

AJMSP

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A simplistic simulation technique has been developed for computing the individual intermetallic compound (IMC) thickness which is formed in substrate-solder (Cu-Sn) systems during the diffusion soldering process in high-temperature power electronic applications. The method requires the time-dependent temperature profile for the soldering process and the growth rate parameters (e.g. concentration gradient, diffusion coefficient, activation energy, etc.) for the development of IMC layers as input. The method is suitable for predicting the thickness of an intermetallic phase layer during the diffusion soldering process. As such, it can be used in high-temperature power electronic application's solder processing to enhance the reliability and lifetime of solder interconnections by allowing the control of the thickness of IMC layers. The method is demonstrated for IMC growth between pure copper as substrate and pure Sn as solder material. The growth behavior of the IMC layer is increased with increasing temperature over time according to the Arrhenius theory in the temperature range between 24°C to 260°C. To simulate the formation of IMC thickness in diffusion soldering interconnections, a simplistic way has been attempted using the popular commercial finite element simulation tool Comsol Multiphysics and scientific computing application 'Matlab'. By means of transient thermal input, the diffusion-controlled intermetallic phase formation is simulated here. Few assumptions are taken care of this simulation process, for example, no convection, no reaction, solid-solid diffusion, no the pressure effect on the computational domain.

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Section: Resultsmentioning

confidence: 99%

Development of a Simplistic Method to Simulate the Formation of Intermetallic Compounds in Diffusion Soldering Process

Chaki¹

2019

AJMSP

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“…Reflow soldering is one stage of the Surface Mount Technology (SMT) used to produce Printed Circuit Boards (PCBs) integrated into all electronic devices that make part of our daily lives (Whalley 2004). Considering the complexity of the PCBs and the complicated thermal response as the PCBs are heated and cooled inside the reflow oven, soldering failures such as cold and/or hot spots, insufficient wetting and overheating joints occur, leading to a productivity loss corresponding to roughly 30-50% of the total manufacturing costs (Costa 2015;Tsai 2012). To enhance the process and minimize product defects, it is crucial to characterize both flow dynamics and heat transfer in the vicinity of the step structure.…”

Section: Introductionmentioning

confidence: 99%

Flow dynamics and heat transfer characterization of confined multiple jets impinging on a complex surface

Barbosa,

Teixeira,

Teixeira

2023

Exp Fluids

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Submerged and confined multiple jet impingement is widely implemented in cooling applications since it provides high heat transfer coefficients and uniformity over the target plate. Its performance depends on several variables that make it complex and difficult to control. To understand the physical phenomena and characterize the flow field, an in-depth study, using Particle Image Velocimetry (PIV) technique and an heat flux sensor, is conducted in this study. The PIV provides relevant data, but the accuracy of the measurements depends on an effective experimental setup and a careful selection of the most appropriate tracer particles. Therefore, this work presents the purpose-built experimental apparatus and comprises an analysis of the efficiency of different seeding particles. The results demonstrate that olive oil particles are appropriate to track turbulent flows since particles with about 1 μm diameter are obtained by the seeding generator. PIV measurements highlight the complexity of the jet flow impinging on a step surface, which induces a strong flow reversal that affects the jet flow development and the interaction with the adjacent jets. The large-scale structures induced in the vicinity of the target plate are captured by the PIV, as well as the strong fountain flows generated between the adjacent jets. Compared with the flat geometry, the turbulence intensity at the central jet is around 25% higher for the 1 D step, while for the 2 D step, this increase reaches 7.5%. The increased turbulence intensity leads to an heat transfer enhancement. For the 2 D step plate, the Nusselt number recorded is 25% greater than the flat plate. Through this study, relevant insights for several engineering applications that use multiple jet impingement are provided, highlighting that the combination of PIV and heat flux sensors are appropriate to characterize the jet’s flow dynamics and the heat transfer of this complex process.

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“…In fact, the mainstream was the finiteelement method (FEM) with advantages that there is no need to consider the complex differential equations and unintelligible physical concepts. While there was a fact that its accuracy was incomparable, the computation was particularly enormous [5,[9][10][11][12][13]. e surface temperature of the motherboard on flexible printed circuit boards was predicted using the simulation software ANSYS, though the reliability of the results still needs further experimental verification [14].…”

Section: Introductionmentioning

confidence: 99%

“…e surface temperature of the motherboard on flexible printed circuit boards was predicted using the simulation software ANSYS, though the reliability of the results still needs further experimental verification [14]. By applying simulation software, the computational fluid dynamics (CFD) models of reflow soldering were also tried [10][11][12]15]. On the other hand, as the reflow soldering model becomes more accurate, on the basis of the temperature profile, the evaluation of soldering quality and optimization of relevant parameters, such as the heat transfer coefficient, heat flow, and reflux cooling time, have gradually been developed [5,16].…”

Section: Introductionmentioning

confidence: 99%

“…Dziurdzia et al performed statistical methods to evaluate convection reflow and vacuum vapor phase reflow, while the randomness of the distribution of voids in solder joints and vacuum convection reflow was a major disadvantage [21]. Furthermore, in the light of the former models, many intelligent algorithms, such as the genetic algorithm (GA) and the back-propagation neural network (BPNN), were utilized to seek the optimal parameters of the reflow oven [12]. For instance, Pan et al put forward a parameter optimization model combined with the BPNN and GA to determine the best parameter setting for reflow soldering contours, contributing to reduce the trial-and-error time in practical applications [2].…”

Section: Introductionmentioning

confidence: 99%

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Effects of the Solder Phase Transformation on the Optimization of Reflow Soldering Parameters and Temperature Profiles

Liu

Zhang

2021

Discrete Dynamics in Nature and Society

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In this study, a heat convection model of the reflow oven and a heat conduction model of the soldering area are proposed based on heat transfer theory, and a dynamic Thomas algorithm is developed for solving linear equations with coefficient matrix evolving over time in the tridiagonal system, which is derived from a heat transfer problem with moving boundaries in the solder phase transition process. We have also carried out numerical simulations for investigating the accuracy of the mathematical model, in which the temperature profiles are calculated and compared for different cases with considering or ignoring phase transformations, respectively. Parameters of reflow soldering, such as the conveyor speed, the set temperature in each zone, and a part of the heating factor, are optimized by the use of the nondominated sorting genetic algorithm II. By comparing the temperature profile and optimal solutions in the two cases, numerical results show that phase transitions of the solder have great impacts on optimal parameters and the slope of temperature profiles. Moreover, the phenomenon that the heating factor varies with the maximum set temperature in a banded distribution is investigated and analyzed, which is an important part of this work.

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Numerical Simulation of Reflow Soldering

Cited by 5 publications

References 5 publications

Development of a Simplistic Method to Simulate the Formation of Intermetallic Compounds in Diffusion Soldering Process

Development of a Simplistic Method to Simulate the Formation of Intermetallic Compounds in Diffusion Soldering Process

Flow dynamics and heat transfer characterization of confined multiple jets impinging on a complex surface

Effects of the Solder Phase Transformation on the Optimization of Reflow Soldering Parameters and Temperature Profiles

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