2019
DOI: 10.11648/j.ajmsp.20190401.17
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Development of a Simplistic Method to Simulate the Formation of Intermetallic Compounds in Diffusion Soldering Process

Abstract: A simplistic simulation technique has been developed for computing the individual intermetallic compound (IMC) thickness which is formed in substrate-solder (Cu-Sn) systems during the diffusion soldering process in high-temperature power electronic applications. The method requires the time-dependent temperature profile for the soldering process and the growth rate parameters (e.g. concentration gradient, diffusion coefficient, activation energy, etc.) for the development of IMC layers as input. The method is … Show more

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Cited by 2 publications
(2 citation statements)
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“…The SLID bonding (also known as Transient Liquid Phase Bonding) is a packaging technique based on intermetallic diffusion between two or more metals, with a hightemperature melting metal (such as Cu or Au) and a low-temperature melting metal (such as Sn or In) under the influence of temperature, time, and pressure. Intermetallic formation is driven by the atomic concentration gradient and can be described by the second Fick's law of diffusion [46]. It states that the diffusive flux goes from a high-concentration area to a low-concentration area proportional to the concentration gradient.…”
Section: Solid-liquid Interdiffusion Bondingmentioning
confidence: 99%
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“…The SLID bonding (also known as Transient Liquid Phase Bonding) is a packaging technique based on intermetallic diffusion between two or more metals, with a hightemperature melting metal (such as Cu or Au) and a low-temperature melting metal (such as Sn or In) under the influence of temperature, time, and pressure. Intermetallic formation is driven by the atomic concentration gradient and can be described by the second Fick's law of diffusion [46]. It states that the diffusive flux goes from a high-concentration area to a low-concentration area proportional to the concentration gradient.…”
Section: Solid-liquid Interdiffusion Bondingmentioning
confidence: 99%
“…The diffusion process of unalloyed copper and tin will accelerate by exceeding the melting point of Sn (T M_Sn = 232 • C). The temperature range used in the literature is between 250 • C and 300 • C [14,15,19,20,46], resulting in intermetallic bonds of Cu 6 Sn 5 (η-phase) and Cu 3 Sn (ε-phase) during the bonding process. The η-phase is formed in the early heating stage.…”
Section: Solid-liquid Interdiffusion Bondingmentioning
confidence: 99%