Interfacial Characteristics and Mechanical Properties of Cu/Ga/Cu Interconnects by Transient Liquid Phase Bonding

Chen, Yi; Liang, Shuibao; Liu, Canyu; Liu, Changqing; Zhou, Zhaoxia

doi:10.1109/eptc53413.2021.9663953

Cited by 6 publications

(4 citation statements)

References 31 publications

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“…Among low-melting metals, Ga-based alloys that have a lower vapor pressure at room temperature exhibit intrinsically stretchable conductors and are less toxic than liquid metal, e.g., mercury (Hg) [ 63 ]. Of course, liquid metals are compressed into elastomers that prevail stretchability for use in electronic devices.…”

Section: Flexible Interconnectsmentioning

confidence: 99%

“…The process has high integration density and mechanical durability, which provides stable operation up to 40% of stretching for a 4 × 4 matrix, as shown in Figure 5c. Among low-melting metals, Ga-based alloys that have a lower vapor pressure at room temperature exhibit intrinsically stretchable conductors and are less toxic than liquid metal, e.g., mercury (Hg) [63]. Of course, liquid metals are compressed into elastomers that prevail stretchability for use in electronic devices.…”

Section: Interconnect Typesmentioning

confidence: 99%

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Interconnection Technologies for Flexible Electronics: Materials, Fabrications, and Applications

2023

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Flexible electronic devices require metal interconnects to facilitate the flow of electrical signals among the device components, ensuring its proper functionality. There are multiple factors to consider when designing metal interconnects for flexible electronics, including their conductivity, flexibility, reliability, and cost. This article provides an overview of recent endeavors to create flexible electronic devices through different metal interconnect approaches, with a focus on materials and structural aspects. Additionally, the article discusses emerging flexible applications, such as e-textiles and flexible batteries, as essential considerations.

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Section: Flexible Interconnectsmentioning

confidence: 99%

Section: Interconnect Typesmentioning

confidence: 99%

Interconnection Technologies for Flexible Electronics: Materials, Fabrications, and Applications

2023

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“…The preceding results have demonstrated the microstructure of the Cu/Ga/Cu joint reacted at 200 • C, with a discernible γ 3 layer being observed. However, earlier investigations have failed to accurately determine the growth of γ 3 layers through SEM at a relatively lower reaction temperature [25,26]. Therefore, HAADF and BF imaging of Cu/IMCs/Cu slices reacted at 150 • C were conducted via TEM to shed further light on the microstructure and composition of IMCs, as illustrated in Fig.…”

Section: Tem Observation Of Cu/ga/cu Tlpb Joint Bonded At 150 • Cmentioning

confidence: 99%

Interfacial Intermetallic Compounds Growth Kinetics and Mechanical Characteristics of Ga-Cu Interconnects Prepared Via Transient Liquid Phase Bonding

Liu,

Chen,

Jiang

et al. 2023

Preprint

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“…TLP bonding offers advantages such as facile processing and cost-effectiveness and has attracted considerable attention and extensive research in recent years. Numerous material combinations have been explored for TLP bonding, including the use of Sn, solder, In, and Ga as the molten layers and Cu, Ag, Ni, and Au as substrates [9][10][11][12][13][14][15][16]. Among these, the Ag-In combination has shown promising potential for TLP bonding.…”

Section: Introductionmentioning

confidence: 99%

Thermomechanical Properties of Zeta (Ag3In) Phase

Liu,

Tatsumi,

Jin

et al. 2023

Materials

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The thermomechanical properties of materials within die-attach joints play an essential role in assessing the reliability of high-power modules. Ag-In transient liquid phase (TLP) bonding serves as an alternative method for die attachment. However, relevant material data for the ζ (Ag3In) phase, one of the Ag-In intermetallic compound (IMC) products of TLP bonding, are limited. This paper proposes an approach to fabricate a densified and pure bulk sample of the ζ (Ag3In) phase. The thermomechanical properties of the ζ (Ag3In) phase were subsequently investigated at elevated temperatures and compared to those of other IMCs frequently observed in die-attach joints. As the temperature increased from 30 °C to 200 °C, the hardness of the ζ (Ag3In) phase decreased linearly from 1.78 GPa to 1.46 GPa. Similarly, the Young’s modulus also decreased linearly from 82.3 GPa to 66.5 GPa. These properties rank among the lowest levels compared to those of other IMCs. The average coefficient of thermal expansion within the temperature range of 70 °C to 250 °C was approximately 18.63 ± 0.61 μm/m/°C, placing the ζ (Ag3In) phase at a moderate level. When considering its potential for mitigating thermal stress, these combined properties render the ζ (Ag3In) phase an appropriate material choice for die-attach joints compared to other IMCs.

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Interfacial Characteristics and Mechanical Properties of Cu/Ga/Cu Interconnects by Transient Liquid Phase Bonding

Cited by 6 publications

References 31 publications

Interconnection Technologies for Flexible Electronics: Materials, Fabrications, and Applications

Interconnection Technologies for Flexible Electronics: Materials, Fabrications, and Applications

Interfacial Intermetallic Compounds Growth Kinetics and Mechanical Characteristics of Ga-Cu Interconnects Prepared Via Transient Liquid Phase Bonding

Thermomechanical Properties of Zeta (Ag3In) Phase

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