Numerical simulation of Al1070 alloy through hybrid SPD process

Kumar, Pintu; Panda, Sudhansu Sekhar

doi:10.1007/s00170-016-9768-9

Cited by 6 publications

(2 citation statements)

References 21 publications

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“…The uniformity improvement of copper deposition was reported in many previous studies (Chen et al , 2017; Dow et al , 2007; Kumar and Panda, 2017; Pantleon et al , 2005; Yang et al , 2017). The uniformity of current distribution could be enhanced by the optimization of geometric construction of plating tank, as the primary current distribution was dependent on geometry of plating tank (Garich et al , 2016; Ji et al , 2015; Laitinen et al , 2014; Yang et al , 2013b).…”

Section: Introductionsupporting

confidence: 71%

“…It is new tend to combine multiphysics coupling simulation and practical production to optimize conditions and cut the cost. In this way, the requirement of minimal experimental workload can be hastened since the emergence of computational software, such as the Elsyca Plating Manager, Ansys and Comsol Multiphysics (Chen et al , 2017; Kumar and Panda, 2017; Liu et al , 2011; Mohammadi et al , 2013; Yang et al , 2017).…”

Section: Introductionmentioning

confidence: 99%

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Improvement of plating uniformity for copper patterns of IC substrate with multi-physics coupling simulation

Xiang

Chen

Wang

et al. 2018

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Purpose Optimized plating conditions, included proper designs of insulating shield (IS), auxiliary cathode (AC) and different patterns, contribute to the uniformity enhancement of copper deposition. Design/methodology/approach Plating experiments were implemented in vertical continuous plating (VCP) line for manufacturing in different conditions. Multiphysics coupling simulation was brought to investigate and predict the plating uniformity improvement of copper pattern. In addition, the numerical model was based on VCP to approach the practical application. Findings With disproportionate current distribution, different plating pattern design formed diverse copper thickness distribution (CTD). IS and AC improved plating uniformity of copper pattern because of current redistribution. Moreover, optimized plating condition for effectively depositing more uniformed plating copper layer in varied pattern designs were derived by simulation and verified by plating experiment. Originality/value The comparison between experiment and simulation revealed that multiphysics coupling is an efficient, reliable and of course environment-friendly tool to perform research on the uniformity of pattern plating in manufacturing.

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