Improvement of plating uniformity for copper patterns of IC substrate with multi-physics coupling simulation

Abstract

Purpose Optimized plating conditions, included proper designs of insulating shield (IS), auxiliary cathode (AC) and different patterns, contribute to the uniformity enhancement of copper deposition. Design/methodology/approach Plating experiments were implemented in vertical continuous plating (VCP) line for manufacturing in different conditions. Multiphysics coupling simulation was brought to investigate and predict the plating uniformity improvement of copper pattern. In addition, the numerical model was based on VCP to approach the practical application. Findings With disproportionate current distribution, different plating pattern design formed diverse copper thickness distribution (CTD). IS and AC improved plating uniformity of copper pattern because of current redistribution. Moreover, optimized plating condition for effectively depositing more uniformed plating copper layer in varied pattern designs were derived by simulation and verified by plating experiment. Originality/value The comparison between experiment and simulation revealed that multiphysics coupling is an efficient, reliable and of course environment-friendly tool to perform research on the uniformity of pattern plating in manufacturing.

Electroanalytical and Electrodeposited Simulation of Ce3+ in Molten LiCl-KCl

“…It is in a good agreement with the previous results and Xiang's work. 33 Larger thickness means faster reaction rate and smaller concentration. In addition, the concentration of Ce 3+ at each point on the curve is greater than the concentration of Ce 3+ initially added to the electrolyte before the start of the reaction.…”

Effects of additives on via filling and pattern plating with simultaneous electroplating

“…Bottom-up filling of blind via has been widely studied. However, there have been relatively few investigations of pattern plating with via filling electrolyte (Chen et al, 2014;Xiang et al, 2018aXiang et al, , 2018b. The main reason is that the pattern is prepared by dry film after exposure and developing, the sidewall of dry film has no metal layer.…”