Numerical characterization and experimental verification of an in-plane MEMS-actuator with thin-film aluminum heater

Meszmer, Peter; Hiller, Karla; Hartmann, Steffen; Shaporin, Alexey; May, Daniel; Rodriguez, Raúl D.; Arnold, J.; Schondelmaier, Gianina; Mehner, Jan; Zahn, Dietrich R. T.; Wunderle, Bernhard

doi:10.1007/s00542-014-2143-6

Cited by 13 publications

(7 citation statements)

References 16 publications

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“…A = 100 μm × 100 μm bond pads). From the list of requirements, thermal actuators (TA, [58][59][60] ) designs with intrinsic (current flow through Si structure, hence direct heat production in Si) and extrinsic heating (current flow through a thin film metal meander on top of Si structure) mechanisms were deduced.…”

Section: System Development and Fabrication Of Tem Test Stagementioning

confidence: 99%

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Towards nanoreliability of sensors incorporating interfaces between single-walled carbon nanotubes and metals: molecular dynamics simulations and in situ experiments using electron microscopy

et al. 2016

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Section: System Development and Fabrication Of Tem Test Stagementioning

confidence: 99%

“…For testing and verification of the designed TEM test stage incorporating TAs with thin-film metal heaters [60] , samples without CNT integration were realized. The fabrication technology is shown in Fig.…”

Section: System Development and Fabrication Of Tem Test Stagementioning

confidence: 99%

Towards nanoreliability of sensors incorporating interfaces between single-walled carbon nanotubes and metals: molecular dynamics simulations and in situ experiments using electron microscopy

et al. 2016

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“…Electrostatic actuation provides a force driven approach, whereas thermal actuation offers displacement driven actuation. Thermal actuators have been proven to be fully integrable by means of electric insulation and have been used in the configuration discussed in this paper even in the environment of a transmission electron microscope . The here presented test stages are based on thermal actuators as well.…”

Section: From Building Blocks To Test Platformsmentioning

confidence: 99%

“…Following a SCA implies that the processes required to create a loading stage have to be compatible with the process flow of the sample. In previous publications, the authors have presented and discussed the principles of SCA compatible test stages and building blocks of such test devices, which can be fitted to different types of samples and testing environments. The SCA idea and concept has been used by different research groups, as shown in refs.…”

Section: Introductionmentioning

confidence: 99%

Highly Miniaturized MEMS‐Based Test Platforms for Thermo‐Mechanical and Reliability Characterization of Nano‐Functional Elements − Technology and Functional Test Results

Meszmer

Hahn

Hiller

et al. 2019

Physica Status Solidi (a)

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This paper reports on concepts, technology, integration aspects, and results of a MEMS-based test platform for reliability tests of micro and nano objects.Building blocks of this platform to be used in in-plane push-pull-configurations are a thermal actuator, a force sensor, and a displacement sensor as well as several types of samples to be integrated directly or indirectly. The technology concept is proven for aluminum wires as a first demonstrator for an integrated specimen. The modular concept enables the adoption of the platform for further types of samples and test configurations. The building blocks are simulated using a Finite-Element approach and the results are compared to experimentally obtained data sets. According to the specifications, the thermal actuator is capable of providing displacements up to 1.5 μm. The displacement and the force sensor are specified to provide sensitivities of 3 fF nm À1 and 2.5 μV nN À1 , respectively. SEM image of a piezoresistive force sensor attached to an integrated Al wire as test sample À building blocks of MEMS-based test platforms.

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“…Although the forces applied on a SWCNT, cannot be measured with such a system directly, i.e., by using an integrated force sensor with electrical read outs, it is possible to obtain the SWCNT strain by digital image correlation (DIC) and calculate the internal forces using the well-known elastic modulus of SWCNTs [30] as well as by accurately measure the SWCNT diameter with TEM. For the pursued in situ studies we designed a Si-based TEM test stage chip that is equipped with V-beam thermal actuators (TAs [31]) to apply mechanical load on to the SWCNTs. The TA is heated by electrical power dissipation due to current flow through thin film metal heaters and has an approximate travel distance of δ = 500 nm while keeping the electrical bias below U = 10 V. The overall chip size is of V = 3 mm×6 mm×0.7 mm and can be used with a TEM sample holder from Hummingbird Scientific that allows for electrical biasing of the chip.…”

Section: In Situ Tensile Test Stage Chipmentioning

confidence: 99%

An in situ tensile test device for thermo-mechanical characterisation of interfaces between carbon nanotubes and metals

Hartmann

Bonitz

Heggen

et al. 2016

2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

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In this paper we present our recent efforts to develop an in situ tensile test device for thermo-mechanical characterization of interfaces between single-walled carbon nanotubes (SWCNTs) and metals. For the mechanical tests, the chosen loading condition is a pull-out test. After summarizing results of maximum stresses calculated from molecular dynamics simulations and obtained from in situ scanning electron microscope experiments we outline the requirement for an in situ experimental method with atomic resolution to study the mechanics of SWCNT-metal interfaces in further detail. To this purpose, we designed, fabricated and characterized a silicon-based micromechanical test stage with a thermal actuator for pull-out tests inside a transmission electron microscope. The objective is to obtain in situ images of SWCNT-metal interfaces under mechanical loads at the atomic scale for fundamental structure investigation. The design of this MEMS test stage permits also the integration of SWCNTs by wafer level technologies. First experiments with this MEMS test stage confirmed the presence of suspended thin metal electrodes to embed SWCNTs. These suspended thin metal electrodes are electron transparent at the designated SWCNT locations. Actuator movements were evaluated by digital image correlation and we observed systematic actuator movements that allow for a defined load application of SWCNTS. Although significant image drifts occured during actuation, we achieved atomic resolution of the metal electrode and stable movement in the focal plane of the electron microscope. The presented system may be also used and further developed for in situ characterization of other materials

show abstract

Numerical characterization and experimental verification of an in-plane MEMS-actuator with thin-film aluminum heater

Cited by 13 publications

References 16 publications

Towards nanoreliability of sensors incorporating interfaces between single-walled carbon nanotubes and metals: molecular dynamics simulations and in situ experiments using electron microscopy

Towards nanoreliability of sensors incorporating interfaces between single-walled carbon nanotubes and metals: molecular dynamics simulations and in situ experiments using electron microscopy

Highly Miniaturized MEMS‐Based Test Platforms for Thermo‐Mechanical and Reliability Characterization of Nano‐Functional Elements − Technology and Functional Test Results

An in situ tensile test device for thermo-mechanical characterisation of interfaces between carbon nanotubes and metals

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