Numerical approach to extraction of elasto-plastic material models and corresponding properties of thin layers through nanoindentation technique

Wymysłowski, Artur; Wittler, Olaf; Mrossko, R.; Dudek, R.; Auersperg, J.; Dowhań, Łukasz

doi:10.1109/esime.2009.4938422

Cited by 6 publications

(4 citation statements)

References 10 publications

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“…This could also be associated to the simplifications done by bilinear elasticplastic laws [10]. In such cases a nonlinear material law resulted in improved results [4,11]. Despite this improvement our new results outlined below still show no uniqueness of the derived plastic material data.…”

Section: Introductionmentioning

confidence: 56%

Characterisation and modelling of the nanoindentation experiment in Au layers

Wittler

Mrossko²,

Huber

et al. 2009

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelect

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The nanoindentation experiment is an established technique for the determination of Hardness and Young's modulus of thin films. This standard data set is not sufficient to he used as input to finite element simulations, because elastic-plastic material data is being required for analysis of reliability of metal layers. Therefore stress-strain Curves are being determined by fitting the force displacement curves of the experiment with a finite-element model. Additionally this approach enables a solution for the so called substrate effect , because the stiffness of the Substrate can be considered in the fitting model. This known approach is being applied and tested on thin (< 500 nm) gold layers deposited on silicon. It is shown that even for indents that exceed 10 % of the film thickness a good sensitivity for Young's Modulus can be reached, but for the plastic data the results are not unique and a range of plastic properties can be fitted. It is shown, that this problem of the method can be solved by correlation of the indent profiles

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Section: Introductionmentioning

confidence: 56%

Characterisation and modelling of the nanoindentation experiment in Au layers

Wittler

Mrossko²,

Huber

et al. 2009

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelect

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Section: Resultsmentioning

confidence: 99%

“…39 Therefore, it is strongly advisable to measure the mechanical properties of sintered silver individually or by using more sophisticated techniques like nanoindentation for more reliable measurements. 40,41 Subsequently, it is extremely critical to control as many as thinkable of the parameters involved in the lifetime assessment process of sintered Ag die bonds for most accurate thermal fatigue life estimations, including but not limited to creep constitutive model and material parameters, geometries, and other characteristics of the power electronic module.…”

Section: Discussion On the Lifetime Analysis Of Sintered Agmentioning

confidence: 99%

Applying Anand versus Garofalo creep constitutive models for simulating sintered silver die attachments in power electronics

Gharaibeh,

Wilde

2023

The Journal of Strain Analysis for Engineering Design

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This paper aims to examine the thermomechanical response of sintered silver die attachments in power electronics using finite element analysis (FEA). In this work, several material parameters of the sintered silver bonds are investigated. Additionally, two common solder creep constitutive laws including Anand and Garofalo models are also studied. To ensure the fidelity of the simulation procedures, the finite element (FE) models are first correlated with digital image correlation data. Afterward, the FE models are utilized to examine the influence of the material and creep models on the die attach stresses, strains, and plastic works. The expected fatigue and lifetime predictions of the sintered silver layer are thoroughly discussed, accordingly. The results proved that the die attach layer mechanical response is highly driven by the material parameters and creep modeling procedures considered throughout the simulations. Thus, the resulting fatigue life is evaluated. Finally, a general modeling guideline for simulating thermomechanical response of sintered silver die attachments in power electronics are provided in great detail.

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“…As only the loading part of the nanoindentation is fitted (see DoCE inputs above and figure 7), it is obvious the FE/experiment results are not superimposed for the unloading part. Nevertheless, according to the objectives fixed during the numerical optimization, several optimums allow the highest desirability, thus there no unique solution as implied by many papers on optimization problem [13,14]! Figure 10 illustrates that fact for a simulated traction test.…”

Section: Modeling Design Of Computer Experiments (Doce) and Resultsmentioning

confidence: 99%

Application of Design of Computer Experiments (DoCE) method for the extraction of the elasto-plastic behavior law of ECD copper through nano-indentation tests

Moreau

Crecy

Mandrillon

2015

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

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This paper report a new methodology combining finite element modeling (FEM) and nanoindentation tests in order to extract the plasticity law of ECD copper film. Thanks to this approach, we demonstrate that simple plasticity law (ANSYS Multilinear ISOtropic hardening (MISO) [1]) reaches the goal of fitting instead of more complex ones (Hollomon-like models [2]). In addition, there is no unique solution but a set of good solutions! 978-1-4799-9950-7/15/$31.00

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Numerical approach to extraction of elasto-plastic material models and corresponding properties of thin layers through nanoindentation technique

Cited by 6 publications

References 10 publications

Characterisation and modelling of the nanoindentation experiment in Au layers

Characterisation and modelling of the nanoindentation experiment in Au layers

Applying Anand versus Garofalo creep constitutive models for simulating sintered silver die attachments in power electronics

Application of Design of Computer Experiments (DoCE) method for the extraction of the elasto-plastic behavior law of ECD copper through nano-indentation tests

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