Numerical and experimental investigations of micromechanical processes during wire sawing

Nassauer, Benjamin; Hess, Andreas; Kuna, Meinhard

doi:10.1016/j.ijsolstr.2014.03.040

Cited by 20 publications

(7 citation statements)

References 16 publications

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“…A 2-dimensional model was proposed to analyze the elasto-hydrodynamic behavior of slurry and it was pointed out that the hydrodynamic behavior of the slurry and the interaction with wire are important factors in sawing operation [2]. However, a later numeric simulation study by Nassauer and Kuna [11] showed that the hydrodynamic forces are too low to induce indentation fracture in substrate. Bidiville et al [12] studied the surface roughness and microcrack density of Si wafers cut by MWSS.…”

Section: Multi-wire Slurry Sawingmentioning

confidence: 99%

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Wire sawing technology: A state-of-the-art review

2016

Precision Engineering

141

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Section: Multi-wire Slurry Sawingmentioning

confidence: 99%

“…This model was adopted by other researchers for system level material rate modeling [11]. However, sawing experiment studies showed that the rolling-indenting model is not accurate for the case of silicon wafering.…”

Section: Indentation and Scribing Models For Wire Sawing Process Analmentioning

confidence: 99%

Wire sawing technology: A state-of-the-art review

2016

Precision Engineering

141

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“…For details on DEM with this specific particle shape the reader is referred to [8] and [9]. The interaction between particles and fluid flow of the slurry is reported in [7] and [10]. In the following, only the most important facts are summarized: The influence of the fluid having a viscosity η on the particle motion is estimated by Stokes law.…”

Section: Numerical Modelmentioning

confidence: 99%

“…In these models the abrasive particles are represented by spheres or clusters of spheres, thus the sharp edges of the real abrasive particles are not represented. First 3D DEM simulations with polyhedral particles can be found in [7]. These polyhedral particles provide a very good representation of the shape of real abrasive particles, including the sharp edges.…”

Section: Introductionmentioning

confidence: 99%

Impact of micromechanical parameters on wire sawing: a 3D discrete element analysis

Nassauer

Kuna

2015

Comp. Part. Mech.

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Wire sawing is one of the most prominent technologies for producing solar wafers. In the following paper a numerical model for the simulation of the wire sawing process at microlevel using the discrete element method is presented. The abrasive particles are represented by convex polyhedra. Based on the contact forces on the ingot, local material removal rates are calculated. These local material removal rates are then used to update the shape of the ingot in a stepwise simulation. The model allows for detailed analysis of the influence of different parameters on the micromechanical processes during wire sawing. In particular the influence of wire speed, lapping pressure, particle concentration, particle size, particle shape and debris on the sawing process is investigated. In a post-processing macroscopic process characteristics like kerf width, depth of surface cracks or sawing rate are calculated. Thus, the processes at the microlevel are related to the macroscopic process characteristics, which are of interest when applying wire sawing in practice.

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“…Researchers have focused on different aspects of the wire sawing process which can be classified into material removal mechanism [5][6][7], process modeling [8][9][10][11], and parametric study between process inputs and outputs [12][13][14][15][16]. In order to fulfill the strict requirements in wafer surface quality, some studies concentrate the ways to minimize surface defects by controlling wire and process parameters [5,13,14].…”

Section: Introductionmentioning

confidence: 99%

Depth of cut per abrasive in fixed diamond wire sawing

Chung

2015

Int J Adv Manuf Technol

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Because of the high requirement for quality, the surfaces of prime wafers have to be flat and without damages. During the first machining process in wafer manufacturing, the defects introduced by wire sawing must be removed by the subsequent lapping, grinding, and polishing processes. Therefore, the quality of sliced wafer is very important. Fixed diamond wire saw, on which the diamond grains are coated as abrasives, has become the major tool to slice ingot into wafers. Ductile-regime machining is an attractive process to achieve crack free surface on brittle materials in abrasive machining process. The depth of cut of the abrasive is a hint for the transition between ductileand brittle-regime machining. In order to understand the cutting behavior in fixed diamond wire sawing, this paper presents an investigation of depth of cut per abrasive based on the wire profile model developed by the authors. The simulation results show that the larger depths of cut are unavoidable in fixed diamond wire sawing because of the random position and size distribution of diamond grains on the wire. Although the number of active abrasives and the depths of cut at the bottom of slicing groove are larger than those at the side of the groove, few larger diamond Van-Nhat Le grains may introduce larger depths of cut and cracks on the side, which is the sliced wafer surface. Effects of process parameters to the depth of cut distributions are also analyzed. The variation in number of active abrasives in cutting zone as well as their depth of cut shows the possibility to increase process productivity without increasing the depths of cut of the diamond grains. Consequently, the surface quality could be remained without further deterioration.

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Numerical and experimental investigations of micromechanical processes during wire sawing

Cited by 20 publications

References 16 publications

Wire sawing technology: A state-of-the-art review

Wire sawing technology: A state-of-the-art review

Impact of micromechanical parameters on wire sawing: a 3D discrete element analysis

Depth of cut per abrasive in fixed diamond wire sawing

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