Wire sawing technology: A state-of-the-art review

Wu, Hao

doi:10.1016/j.precisioneng.2015.08.008

Cited by 141 publications

(57 citation statements)

References 62 publications

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“…It is mostly used in the form of wafers sliced by costly wire-sawing from ingots 1–5 . However, due to kerf loss, the slicing of ingot into wafers wastes great amount of expensive, high pure feedstock.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of silicon films from patterned protruded seeds

Zeng

Zhang

et al. 2017

AIP Advances

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Thin, flexible silicon crystals are starting up applications such as light-weighted flexible solar cells, SOI, flexible IC chips, 3D ICs imagers and 3D CMOS imagers on the demand of high performance with low cost. Kerfless wafering technology by direct conversion of source gases into mono-crystalline wafers on reusable substrates is highly cost-effective and feedstock-effective route to cheap wafers with the thickness down to several microns. Here we show a prototype for direct conversion of silicon source gases to wafers by using the substrate with protruded seeds. A reliable and controllable method of wafer-scaled preparation of protruded seed patterns has been developed by filling liquid wax into a rod array as the mask for the selective removal of oxide layer on the rod head. Selectively epitaxial growth is performed on the protruded seeds, and the voidless film is formed by the merging of neighboring seeds through growing. And structured hollows are formed between the grown film and the substrate, which would offer the transferability of the grown film and the reusability of the protruded seeds.

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Section: Introductionmentioning

confidence: 99%

Fabrication of silicon films from patterned protruded seeds

Zeng

Zhang

et al. 2017

AIP Advances

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“…Multi-wire sawing is an excellent slicing method for hard and brittle materials, such as silicon ingots, magnetic materials, ceramics, and sapphire [1]. In recent years, multi-wire sawing has emerged as the mainstream slicing method for ingots with large diameter.…”

Section: Introductionmentioning

confidence: 99%

Extremely Thin Metal Foil Blades as Cutting Tools for Hard and Brittle Materials

et al. 2018

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The manufacturing costs of semiconductor products such as silicon wafers can be reduced by decreasing the kerf loss. In addition, a decrease in the kerf loss leads to an effective utilization of rare materials, which is environmentally beneficial from the viewpoint of saving resources. This study aims to reduce the kerf loss during slicing hard and brittle materials. Therefore, the possibility of using an extremely thin metal foil blade instead of a wire tool in slicing was examined. Initially, grooving characteristics using a metal foil blade (thickness: 50 μm or less) was investigated. The main conclusions are that grooving with a metal foil blade is possible and kerf loss can be reduced. The groove depth tends to increase as the machining time and particle size of abrasives increase. The groove width is smaller when a thin metal foil blade is used and vice versa. However, if the abrasive particle size is too large, grooving becomes impossible. Since the wear of metal foil blade increases with an increase in the particle size of the abrasive, it is necessary to use an abrasive with a particle size that is suitable for the thickness of the metal foil blade.

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“…Multi-wire sawing is an excellent slicing method for hard and brittle materials, such as silicon ingots, magnetic materials, ceramics, and sapphire [1]. Multi-wire sawing has become the mainstream slicing system for large-diameter ingots in recently years.…”

Section: Introductionmentioning

confidence: 99%

Fundamental Characteristics of Grooving Aiming at Reduction of Kerf Loss Using an Ultrafine Wire Tool

Sakamoto

Hayashi

Gemma

et al. 2017

IOP Conf. Ser.: Mater. Sci. Eng.

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Abstract. Thinning of silicon wafers and reduction of kerf loss can minimize the manufacturing costs of semiconductor products. Currently, the volume of kerf loss is about the same as the volume of the wafer itself. Therefore, we study slicing techniques for silicon wafers that result in reduced kerf loss by using an ultrafine wire tool and fine abrasive grains. As a first step, grooving characteristics using an ultrafine tungsten wire tool and fine abrasive grains are investigated in this paper. A borosilicate glass is used as the work material. The main conclusions are as follows: Precision machining using ultrafine wire tool is possible and the kerf loss decreases because the groove width decreases. However, a larger diameter of the wire tool results in a deeper groove. A faster relative speed produces a shorter wire tool lifetime, but a deeper groove. To supply enough abrasive grains to the machined portion, it is necessary to use abrasive grains having a suitable particle size for the specific diameter of the ultrafine wire tool.

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Wire sawing technology: A state-of-the-art review

Cited by 141 publications

References 62 publications

Fabrication of silicon films from patterned protruded seeds

Fabrication of silicon films from patterned protruded seeds

Extremely Thin Metal Foil Blades as Cutting Tools for Hard and Brittle Materials

Fundamental Characteristics of Grooving Aiming at Reduction of Kerf Loss Using an Ultrafine Wire Tool

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