Numerical Analysis of the Welding Behaviors in Micro-Copper Bumps

Hwang, Yeong‐Maw; Pan, Cheng‐Tang; Chen, Bo-Syun

doi:10.3390/met11030460

Cited by 4 publications

(2 citation statements)

References 33 publications

(35 reference statements)

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“…[5][6][7][8]. Taking a typical 2.5 D advanced package as an example, CoWoS (chip on wafer on substrate) is a packaging structure based on a silicon adapter board and TSV technology and launched by TSMC in 2012 [9,10]. As shown in Figure 2, logic chips with the same or different functions are interconnected at ultra-short intervals through micro bumps to reduce heat generation and parasitic resistors and capacitors, to achieve the goal of small size, low power consumption, and fewer pins.…”

Section: Introductionmentioning

confidence: 99%

Research on Surface Morphology of Gold Micro Bumps Based on Monte Carlo Method

Tian

Qian

et al. 2023

Micromachines

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In advanced packaging technology, the micro bump has become an important means of chip stacking and wafer interconnection. The reliability of micro bumps, which plays an important role in mechanical support, electrical connection, signal transmission and heat dissipation, determines the quality of chip packaging. Surface morphological defects are one of the main factors affecting the reliability of micro bumps, which are closely related to materials and bonding process parameters. In this paper, the electrodeposition process of preparing gold bumps is simulated at the atomic scale using the Kinetic Monte Carlo method. The differences in surface morphology and roughness of the plated layer are studied from a microscopic perspective under different deposition parameters. The results show that the gold micro bumps prepared by electrodeposition have better surface quality under conditions of lower deposition voltage, lower ion concentration and higher plating temperature, which can provide significant guidance for engineering applications.

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Section: Introductionmentioning

confidence: 99%

Research on Surface Morphology of Gold Micro Bumps Based on Monte Carlo Method

Tian

Qian

et al. 2023

Micromachines

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“…Thermocompression and thermosonic are the common bonding method for pure metal bumps [23,24]. The Au bump and copper (Cu) bump are representative pure metal bumps [25,26]. Although the manufacturing price of Cu bumps is lower, the easy oxidation property of Cu is a potential threat to bonding strength because the oxide could improve bonding temperature and hinder the diffusion of Cu atoms [27,28].…”

Section: Introductionmentioning

confidence: 99%

Height Uniformity Simulation and Experimental Study of Electroplating Gold Bump for 2.5D/3D Integrated Packaging

et al. 2022

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With the rapid development of nano/micro technology for commercial electronics, the typical interconnection method could not satisfy the high power-density packaging requirement. The 2.5D/3D integrated packaging was seen as a promising technology for nano/micro systems. The gold (Au) bump was the frequently used bonding method for these systems because of its excellent thermal, electric, and mechanical performance. However, relatively little work has been performed to analyze its height uniformity. In this study, the simulation and experimental methods were used to analyze the Au bump height uniformity. Firstly, the electroplating process of Au bump under different flow field parameters was simulated by COMSOL software. The simulated results indicated that the Au+ concentration polarization was the significant reason that caused the non-uniform distribution of Au bump along the wafer radius. Meanwhile, the flow field parameters, such as inlet diameter, inlet flow, titanium (Ti), wire mesh height, and Ti wire mesh density, were optimized, and their values were 20 mm, 20 L/min, 12 mm, and 50%, respectively. Subsequently, the Au bump height uniformity under different current densities was analyzed through an experimental method based on these flow field parameters. The experimental results showed that the increases of current density would decrease the Au bump height uniformity. When the current density was 0.2 A/dm2, the average height, range, and deviance values of Au bump were 9.04 μm, 1.33 μm, and 0.43 μm, respectively, which could reach the requirement of high density and precision for 2.5D/3D integrated packaging.

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