Nucleation and growth of Ag3Sn in Sn-Ag and Sn-Ag-Cu solder alloys

Machine learning search for stable binary Sn alloys with Na, Ca, Cu, Pd, and Ag

“…Structural solutions proposed since the compound's discovery in 1926 [154] include a disordered hcp phase [155], an orthorhombic displacive homeotype β-TiCu (Cmcm) [156], and the D0 a -Cu 3 Ti prototype (P mmn) [157]. The latest studies [48,50,[158][159][160] point to a general consensus that the equilibrium ϵ phase has the ordered Cu 3 Ti-type structure (oP8). Study of Ag-Sn compounds is of significant importance in the ongoing development of Pb-free solders for highperformance electronic devices [48,50,[161][162][163].…”

“…The latest studies [48,50,[158][159][160] point to a general consensus that the equilibrium ϵ phase has the ordered Cu 3 Ti-type structure (oP8). Study of Ag-Sn compounds is of significant importance in the ongoing development of Pb-free solders for highperformance electronic devices [48,50,[161][162][163]. The binary eutectic intermetallic is an integral part of the Snrich multicomponent alloys with Cu, Sb, Bi, and In optimized for robust operation under mechanical and thermal stresses.…”

“…In particular, the extensive work discussed in Ref. [50] has demonstrated that joints' resistance to creep and thermal fatigue is strongly affected by the morphology of Ag 3 Sn forming during solder solidification. A recent transport study has also indicated that Ag 3 Sn is a topological material with a nontrivial Berry phase and a possible candidate for valleytronics [160].…”

“…Structural solutions proposed since the compounds discovery in 1926 158 include a disordered hcp phase, 159 an orthorhombic displacive homeotype b-TiCu (Cmcm), 160 and the D0 a -Cu 3 Ti prototype (Pmmn). 161 The latest studies 51,53,[162][163][164] point to a general consensus that the equilibrium e phase has the ordered Cu 3 Ti-type structure (oP8).…”

“…[45][46][47] Tin alloys have been extensively investigated as non-toxic alternatives to Pb-free solders and durable joint materials in electronics interconnects. 28,29,[48][49][50][51][52][53] The efforts have focused on finding tin intermetallics that can balance high mechanical stability, high thermal conductivity, resistance to Sn-whisker formation, cost effectiveness, and other factors important for next-generation integrated circuits. 48,50 A number of tin-based materials have been studied for their non-trivial topological behavior.…”