Novel [Topography-Sensitive] Bottom-Up Growth of Ruthenium and Copper for Filling Nano-Features Using Supercritical Co<sub>2</sub> Fluids: Beyond Scalability

Kondoh, Eiichi; Hirose, M.; Ukai, E.; Nagano, Keita

doi:10.1557/proc-0992-d02-03

Cited by 4 publications

(3 citation statements)

References 7 publications

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“…This clearly indicates that the nanopores were filled with metallic Cu, and this agrees well with previously reported results. 19,24,27) The presence of Cu in the film was also studied by Auger electron microscopy (AES) depth analysis. Figure 2 shows plots of Cu, Si, and O intensities against the etching cycle.…”

Section: Nanopore Filling Under Typical Deposition Conditionsmentioning

confidence: 99%

“…This phenomenon is completely different from those that occur during wet or vapor deposition processes. Kondoh and coworkers [23][24][25] and Kano et al 13) pointed out that the precursor condensation or liquefaction on the substrate surface can take place during SFCD. Sasaki et al proved the presence of a thick absorbing layer on the surface by in situ ellipsometry.…”

Section: Introductionmentioning

confidence: 99%

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Selective Cu filling of nanopores using supercritical carbon dioxide

Kondoh

Tamegai

Watanabe

et al. 2015

Jpn. J. Appl. Phys.

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Supercritical fluid chemical deposition is known for its superior capability of filling metals into nanofeatures. The mechanism behind this filling capability has not been well understood and can be very different from those of other deposition techniques such as chemical vapor deposition. We have proposed a filling mechanism where the precursor condenses preferentially in narrow concave features and then converts into a metal deposit. In accordance with these two sequential phenomena, the narrower the feature is, the better the filling will be achieved. In this article, selective Cu deposition into nanopores of a silica-based porous thin film is described. When the conventional supercritical fluid deposition method was employed, a significant amount of Cu penetrated into the nanopores along with the continuous film formation on the substrate surface. By illuminating UV light before the start of Cu nucleation, Cu deposited selectively only inside the nanopores. During the selective deposition, optical changes in the porous film were investigated by in situ ellipsometry. These results indicate that the precursor condenses preferentially only in the nanopores and converts into a metal deposit.

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Section: Nanopore Filling Under Typical Deposition Conditionsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Selective Cu filling of nanopores using supercritical carbon dioxide

Kondoh

Tamegai

Watanabe

et al. 2015

Jpn. J. Appl. Phys.

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“…Kondoh et al advocated multiplayer adsorption or liquefaction of the precursor from their observation of topography sensitive growth as a phenomenon where metal growth occurs selectively in concave features. [36][37][38] They used a hot-wall batch reactor and therefore assumed a thermodynamically isothermal system where the multilayer adsorption occurs by attractive interactions between precursor molecules or physisorption [see Fig. 14(a)].…”

Section: Mechanism Of X Layer Formationmentioning

confidence: 99%

In-situ Spectroscopic Ellipsometry of the Cu Deposition Process from Supercritical Fluids: Evidence of an Abnormal Surface Layer Formation

Sasaki

Tamegai

Ueno

et al. 2012

Jpn. J. Appl. Phys.

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In this paper, we report in-situ spectroscopic ellipsometry of Cu deposition from supercritical carbon dioxide fluids. The motivations of this work were 1) to perform a detailed observation of Cu growth with precision optical metrology, 2) to study substrate dependence on Cu growth, particularly for Ru and TiN substrates in the present case, and 3) to demonstrate the possibility and usefulness of ellipsometry for diagnosing supercritical fluid processing. The Cu deposition was carried out through hydrogen reduction of a Cu-diketonate precursor at 160-180 C. During growth, a very large deviation of ellipsometric parameters (É and Á) from a single-layer model prediction was observed; this deviation was much larger than that expected from island formation which has been frequently reported in in-situ ellipsometric observation of the vapor growth of thin films. From model analyses, it was found that an abnormal dielectric layer having a high refractive index and a thickness of 10-50 nm is present on the growing Cu surface. The refractive index of this layer was ð1:5{2Þ þ ð0:2{0:3Þi; and from this, we concluded that this layer is the condensed precursor. The condensed layer develops prior to Cu nucleation. As for the substrate dependence on Cu growth, both layers develop faster on Ru than on TiN. This corresponds to the fact that chemisorption occurs more easily on Ru. The deposition kinetics under the presence of the condensed layer are also discussed.

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Low temperature deposition of titanium oxide containing thin films in trench features from titanium diisopropoxide bis(dipivaloylmethanate) in supercritical CO2

Kano

Uchida

Koda

2009

The Journal of Supercritical Fluids

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Novel [Topography-Sensitive] Bottom-Up Growth of Ruthenium and Copper for Filling Nano-Features Using Supercritical Co₂ Fluids: Beyond Scalability

Cited by 4 publications

References 7 publications

Selective Cu filling of nanopores using supercritical carbon dioxide

Selective Cu filling of nanopores using supercritical carbon dioxide

In-situ Spectroscopic Ellipsometry of the Cu Deposition Process from Supercritical Fluids: Evidence of an Abnormal Surface Layer Formation

Low temperature deposition of titanium oxide containing thin films in trench features from titanium diisopropoxide bis(dipivaloylmethanate) in supercritical CO2

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Novel [Topography-Sensitive] Bottom-Up Growth of Ruthenium and Copper for Filling Nano-Features Using Supercritical Co2 Fluids: Beyond Scalability

Cited by 4 publications

References 7 publications

Selective Cu filling of nanopores using supercritical carbon dioxide

Selective Cu filling of nanopores using supercritical carbon dioxide

In-situ Spectroscopic Ellipsometry of the Cu Deposition Process from Supercritical Fluids: Evidence of an Abnormal Surface Layer Formation

Low temperature deposition of titanium oxide containing thin films in trench features from titanium diisopropoxide bis(dipivaloylmethanate) in supercritical CO2

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Novel [Topography-Sensitive] Bottom-Up Growth of Ruthenium and Copper for Filling Nano-Features Using Supercritical Co₂ Fluids: Beyond Scalability