Abstract:In this research, we applied several new ideas for a novel thermal convection inclinometer design. (1) A flexible polyimide (PI) substrate was used instead of a silicon wafer so that the new design can reduce the energy loss of the heater to the substrate. (2) Both the heater and thermal sensors were formed directly on the PI substrate without floating over a grooved cavity on a silicon wafer so that the device is more reliable and cheaper. (3) Inert xenon gas was filled into a hemicylindrical chamber instead … Show more
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