“…Materials reported in the literature as substrate material for bonding are fused silica [7-9, 13, 28, 32-37], Zerodur ® [13,21], ULE ® [21,22], SiC [15][16][17][18][19][20], silicon [32,[38][39][40][41], sapphire [25,34,40,42], BK7 [18,26], glass and aluminium [26], soda lime glass [27] and PZT [23,24]. Examples of hydroxide solutions commonly used for bonding are potassium hydroxide (KOH) [9,13,21,25,33,36,40,41], sodium hydroxide (NaOH) [13,21,22,25] and sodium silicate solution [13, 16-21, 23-26, 28, 32, 34-39], which is a sodium hydroxide solution with a colloidal silicate (typically 10-14% NaOH, 27% SiO 2 ) dissolved in water.…”