2023
DOI: 10.1016/j.mseb.2023.116343
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Novel technique to study the wet chemical etching response of multi-crystalline silicon wafers

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Cited by 8 publications
(3 citation statements)
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“…Thus, it is possible to see 3D space position of the certain grain orientations. Further, analysis of such plots is presented elsewhere [14] .
Fig.
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Section: Methods Validationmentioning
confidence: 99%
“…Thus, it is possible to see 3D space position of the certain grain orientations. Further, analysis of such plots is presented elsewhere [14] .
Fig.
…”
Section: Methods Validationmentioning
confidence: 99%
“…In this case, 4.83 M potassium hydroxide and 1.89 M Isopropyl Alcohol were used at a temperature of 80 ± 5°C. For NaOCl-based etching, ( NaOCl/KOH/IPA/DI water ), 1.06 M sodium hypochlorite, 1.61 M potassium hydroxide, and 1.9 M isopropyl alcohol were used at a temperature of 80 ± 5°C, and the NaOCl acts as an oxidising agent in the etching process and helps in improving the etching rate [25,26]. UV-Visible spectroscopy (SHIMADZU-2600, Japan) analysis was carried out before and after the etching process to study the variation of reflectance.…”
Section: Methodsmentioning
confidence: 99%
“…However, their vast application in the industry is hindered by the high cost of instrumentation. Wet chemical etching [13,14] can fabricate SiNWs with low-cost alternatives, but it is prone to isotropic etching, and the qualities of SiNWs can be influenced by the etching solution's concentration and composition. MaCE plays an essential role in the preparation of SiNWs due to its simplicity, versatility, and cost-effectiveness compared with other etching methods.…”
Section: Introductionmentioning
confidence: 99%