Novel Sn-0.7Cu composite solder reinforced with ultrafine nanoscale nickel particles/porous carbon

Interfacial reaction of Sn-1.5Ag-2.0Zn low-silver lead-free solder with oriented copper

“…The intermetallic compounds (IMCs) Ag 3 Sn and Cu 6 Sn 5 at the solder joints are in coarse slats after aging of the solder. They are brittle and affect reliability [ [21] , [22] , [23] , [24] , [25] , [26] ]. Low silver content solder can reduce the cost of solder.…”

Site-selective core/shell deposition of tin on multi-segment nanowires for magnetic assembly and soldered interconnection

“…Nanomaterial manufacturing strategies have broadly incorporated principles from wet chemistry [15], machine learning [16], electroplating [17,18], catalytic pyrolysis [19,20], and lithography [21] in establishing a high degree of control over composition and dimensionality of various nanostructures [22][23][24]. Thus far, however, techniques for joining nanomaterial components into more sophisticated configurations [25][26][27] are relatively underrepresented in the literature, related to miniaturization challenges in adapting traditional manufacturing strategies to the nanoscale.…”