Novel MEMS Devices Based on Conductive Polymers

Takamatsu, Seiichi; Itoh, Toshihiro

doi:10.1149/2.f03123-4if

Cited by 5 publications

(3 citation statements)

References 19 publications

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“…PEDOT:PSS is a conductive and transparent polymer that is stretchable, highly ductile and environmentally stable [29]. It has been used as smart textiles [21], flexible piezoresistive strain gauge sensors [22][23] and touch sensors [24]. Typical conventional metal films has a gauge factor of 2, PEDOT:PSS's gauge factor ranges from 5 to 20, makes it an ideal choice for our work.…”

Section: Piezoresistive Pressure Sensormentioning

confidence: 99%

Piezoresistive pressure sensor array for robotic skin

Mirza¹,

Sahasrabuddhe²,

Baptist³

et al. 2016

Sensors for Next-Generation Robotics III

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Robots are starting to transition from the confines of the manufacturing floor to homes, schools, hospitals, and highly dynamic environments. As, a result, it is impossible to foresee all the probable operational situations of robots, and preprogram the robot behavior in those situations. Among human-robot interaction technologies, tactile sensing is an intuitive physical interaction method that can help define operational behaviors for robots cooperating with humans. Multimodal robotic skin with distributed sensors can help robots to increase their perception capabilities according to the surrounding environments.Electro-Hydro-Dynamic (EHD) printing is a flexible multi-modal sensor fabrication method because of its direct printing capability of a wide range of materials onto substrates with non-uniform topographies. In past work we designed interdigitated comb electrodes as a sensing element and printed piezoresistive strain sensors using customized EHD printable PEDOT:PSS based inks. We formulated a PEDOT:PSS derivative ink, by mixing PEDOT:PSS and DMSO. Bending induced characterization tests of prototyped sensors showed high sensitivity and sufficient stability.In this paper, we describe SkinCells, robot skin sensor arrays integrated with electronic modules. 4x4 EHD-printed arrays of strain sensors was packaged onto Kapton sheets and silicone encapsulant and interconnected to a custom electronic module that consists of a microcontroller, Wheatstone bridge with adjustable digital potentiometer, multiplexer, and serial communication unit. Thus, SkinCell's electronics can be used for signal acquisition, conditioning, and networking between sensor modules. Several SkinCells were loaded with controlled pressure, temperature and humidity testing apparatuses, and testing results are reported in this paper.

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Section: Piezoresistive Pressure Sensormentioning

confidence: 99%

Piezoresistive pressure sensor array for robotic skin

Mirza¹,

Sahasrabuddhe²,

Baptist³

et al. 2016

Sensors for Next-Generation Robotics III

View full text Add to dashboard Cite

show abstract

“…PEDOT:PSS is a transparent, conjugated and conductive polymer that is highly ductile, stretchable, and has good environmental stability. Several researchers have fabricated and characterized tactile sensors using PEDOT:PSS for smart textiles [5] flexible piezoresistive strain gauge sensors [6.7] and touch sensors [8]. Its success as a sensing material can be attributed to its gauge factor, 5 to 20, whereas that of conventional metal films is about 2.…”

Section: Pressure Sensors For Robotic Skinsmentioning

confidence: 99%

EHD printing of PEDOT: PSS inks for fabricating pressure and strain sensor arrays on flexible substrates

et al. 2015

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Robotic skins with multi-modal sensors are necessary to facilitate better human-robotic interaction in non-structured environments. Integration of various sensors, especially onto substrates with non-uniform topographies, is challenging using standard semiconductor fabrication techniques. Printing is seen as a technology with great promise that can be used for sensor fabrication and integration as it may allow direct printing of different sensors onto the same substrate regardless of topology. In this work, we investigate Electro-Hydro-Dynamic (EHD) printing, a method that allows printing of micron-sized features with a wide range of materials, for fabricating pressure sensor arrays using Poly(3,4-ethylenedioxythiophene):Polystyrene Sulfonate (PEDOT:PSS). Fabrication of such sensors has been achieved by prepatterning gold or platinum metallized interdigitated comb electrode arrays on a polyimide substrate, with three custom made PEDOT:PSS based inks printed directly onto the electrode arrays. These three inks include a formulation of PEDOT:PSS and NMP; PEDOT:PSS, PVP, and NMP; and PEDOT:PSS, PVP, Nafion, and NMP. All these inks were successfully printed onto sensor elements. The initial results of bending-induced strain tests on the fabricated sensors display that all the inks are sensitive to strain. This confirms their suitability for pressure and strain sensor applications; however, the behavior of each ink; including sensitivity, linearity, and stability; is unique to the type.

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“…Typical MEMS actuators are mostly driven by thermal or electrostatically methods. others in the context of Organic LEDs, polymer transistors and other electronic display technologies[34][35][36][37][38][39][40].2.3 MicrorobotsBased on the precise motion by different microstructures as the actuators driven with internal or external force or energy on MEMS technology, microrobots' applications and developments have been increasingly attractive for medical applications, especially for diagnosis and surgery. A variety of micro actuators have been actively investigated In general, there are two main categories for classifying microrobots: field actuated microrobots and biomimetic microrobots as described below.…”

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confidence: 99%

Challenges in flexible microsystem manufacturing : fabrication, robotic assembly, control, and packaging.

Wei¹

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Microsystems have been investigated with renewed interest for the last three decades because of the emerging development of microelectromechanical system (MEMS) technology and the advancement of nanotechnology. The applications of microrobots and distributed sensors have the potential to revolutionize micro and nano manufacturing and have other important health applications for drug delivery and minimal invasive surgery. A class of microrobots studied in this thesis, such as the Solid Articulated Four Axis Microrobot (sAFAM) are driven by MEMS actuators, transmissions, and end-effectors realized by 3-Dimensional MEMS assembly. Another class of microrobots studied here, like those competing in the annual IEEE Mobile Microrobot Challenge event (MMC) are untethered and driven by external fields, such as magnetic fields generated by a focused permanent magnet. A third class of microsystems studied in this thesis includes distributed MEMS pressure sensors for robotic skin applications that are manufactured in the cleanroom and packaged in our lab. vi In this thesis, we discuss typical challenges associated with the fabrication, robotic assembly and packaging of these microsystems. For sAFAM we discuss challenges arising from pick and place manipulation under microscopic closed-loop control, as well as bonding and attachment of silicon MEMS microparts. For MMC, we discuss challenges arising from cooperative manipulation of microparts that advance the capabilities of magnetic micro-agents. Custom microrobotic hardware configured and demonstrated during this research (such as the NeXus microassembly station) include micro-positioners, microscopes, and controllers driven via LabVIEW. Finally, we also discuss challenges arising in distributed sensor manufacturing. We describe sensor fabrication steps using clean-room techniques on Kapton flexible substrates, and present results of lamination, interconnection and testing of such sensors are presented. vii TABLE OF CONTENTS

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Novel MEMS Devices Based on Conductive Polymers

Cited by 5 publications

References 19 publications

Piezoresistive pressure sensor array for robotic skin

Piezoresistive pressure sensor array for robotic skin

EHD printing of PEDOT: PSS inks for fabricating pressure and strain sensor arrays on flexible substrates

Challenges in flexible microsystem manufacturing : fabrication, robotic assembly, control, and packaging.

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