2009 IEEE International Interconnect Technology Conference 2009
DOI: 10.1109/iitc.2009.5090373
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Novel low-k SiOC (k=2.4) with superior tolerance to direct polish and ashing for advanced BEOL integration

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Cited by 3 publications
(4 citation statements)
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“…[34][35][36][37][38] The binding energy at 577.28 eV indicates the presence of Cr(OH) 3 (or CrOOH). [37][38][39][40][41] Figure 2c showst he high-resolution scan of O1s, where the peaks at 530.40a nd 531.44 eV are assigned to Cr 2 O 3 and Cr(OH) 3 (or CrOOH), [40] respectively.H owever,t he peak at 532.35 eV is somewhat com-plicated. It may come from the OÀHo fc hemisorbed dissociated water on the Cr 2 O 3 surface, [38,39] or it may also arise from the combination of Ca nd O.…”
Section: Compositions and Morphologymentioning
confidence: 99%
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“…[34][35][36][37][38] The binding energy at 577.28 eV indicates the presence of Cr(OH) 3 (or CrOOH). [37][38][39][40][41] Figure 2c showst he high-resolution scan of O1s, where the peaks at 530.40a nd 531.44 eV are assigned to Cr 2 O 3 and Cr(OH) 3 (or CrOOH), [40] respectively.H owever,t he peak at 532.35 eV is somewhat com-plicated. It may come from the OÀHo fc hemisorbed dissociated water on the Cr 2 O 3 surface, [38,39] or it may also arise from the combination of Ca nd O.…”
Section: Compositions and Morphologymentioning
confidence: 99%
“…[37][38][39][40][41] Figure 2c showst he high-resolution scan of O1s, where the peaks at 530.40a nd 531.44 eV are assigned to Cr 2 O 3 and Cr(OH) 3 (or CrOOH), [40] respectively.H owever,t he peak at 532.35 eV is somewhat com-plicated. It may come from the OÀHo fc hemisorbed dissociated water on the Cr 2 O 3 surface, [38,39] or it may also arise from the combination of Ca nd O. [38] To sum up, this product is mainly composed of Cr 2 O 3 ,a ccompanied by Cr(OH) 3 .C r(OH) 3 may arise from the followingr eaction [Eq.…”
Section: Compositions and Morphologymentioning
confidence: 99%
“…The vinyl groups promote formation of a labile second phase which can be removed by annealing. Asami et al [ 55 ] prepared a film with K = 2.4 using an unspecified organosilane compound containing an acetylene bond. The low dielectric constant was achieved after e-beam curing.…”
Section: Dielectric Deposition Processesmentioning
confidence: 99%
“…However, it has been reported that this has some risks such as the degradation of dielectric breakdown characteristics and time-dependent dielectric breakdown (TDDB) reliability. [10][11][12][13] In this paper, we demonstrate the effects of Cu interconnect integration using direct CMP process on porous low-k film. Reliability was improved by using a porous lowk film with higher resistance against CMP damage in addition to setting soft CMP conditions to reduce the damage.…”
Section: Introductionmentioning
confidence: 99%