2010
DOI: 10.1109/ted.2009.2037372
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Novel Low-$k$ Dielectric Buried-Layer High-Voltage LDMOS on Partial SOI

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Cited by 31 publications
(10 citation statements)
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“…2, which is divided into NI and NII, and the Wlat is the lateral depletion width. And when Wlat satisfies Lm-1≤Wlat≤Lm (m=1, 2 … n, i=1, 2 … m), the surface electric field of NI will be obtained as (16).…”
Section: ( ) ( )mentioning
confidence: 99%
See 1 more Smart Citation
“…2, which is divided into NI and NII, and the Wlat is the lateral depletion width. And when Wlat satisfies Lm-1≤Wlat≤Lm (m=1, 2 … n, i=1, 2 … m), the surface electric field of NI will be obtained as (16).…”
Section: ( ) ( )mentioning
confidence: 99%
“…In order to improve the performance of lateral SOI high voltage devices, design researchers have proposed a variety of optimization schemes for new device structures: air partial SOI (APSOI) structure [11], single step buried oxide layer SOI (SBOSOI) structure [12], double step buried oxide layer SOI (BODSSOI) structure [13], P-type buried layer SOI (BPSOI) structure [14], variable low-k dielectric buried layer BPSOI (VLKD BPSOI) structure [15], and low-k dielectric buried layer PSOI (LK PSOI) structure [16]. Under the effect of electric field modulation [17], these changes in buried layer will introduce new electric field peaks on the surface of the drift region, which will make the surface electric field distribution more evenly and improve the performance of SOI LDMOS significantly.…”
Section: Introductionmentioning
confidence: 99%
“…Moreover, the first peaks are higher than the corresponding peaks at the drain end for both SOI and PSOI structures, implying that the RESURF effect is hardly to be perfectly achieved under small device dimensions and uniform doping drift region. Better RESURF can be achieved in devices of larger dimensions (Hu et al, 2012;Luo et al, 2008Luo et al, , 2010 or linear doping drift region (Guo, Li, & Zhang, 2006;Merchant, 1991;Shengdong, Sin, Lai, & Ko, 1999;Tadikonda et al, 2004), in which the surface electric fields at the source and drain ends are more symmetric and uniform. Figure 4(b).…”
Section: International Journal Of Electronics 39mentioning
confidence: 99%
“…>15 μm (Luo et al, 2010;Park et al, 2003;Tadikonda et al, 2004) and >100 μm (Luo et al, 2008). However, the tendency of device scaling down is irrefragable in semiconductor technology.…”
Section: Introductionmentioning
confidence: 99%
“…The main problem is low breakdown voltage and many structures are proposed to obtain high breakdown voltage [10][11][12].…”
Section: Introductionmentioning
confidence: 99%