Novel in-situ constructing approach for vertically aligned AlN skeleton and its thermal conductivity enhancement effect on epoxy

Wu, Liangqing; Xiang, Daoping

doi:10.1016/j.ceramint.2022.11.115

Cited by 10 publications

(7 citation statements)

References 63 publications

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“…21 For example, Zhao et al 22 reported an epoxy-based composite with stearic acid-modified AlN particles as the primary filler and silicon carbide nanowires (SiCNWs) as the secondary filler, which showed a maximum thermal conductivity value of 2.56 W m −1 K −1 in the vertical direction at a filler ratio of 55 vol%. Wu et al 23 obtained three-dimensional AlN skeletons (3D-AlNNS) by the ice template method, and subsequently prepared the AlN/epoxy composites by vacuum infiltration. The thermal conductivity of the composite containing 39.69 vol% AlN reached 4.29 W m −1 K −1 , which was 21.45 times higher than that of pure epoxy resin.…”

Section: Introductionmentioning

confidence: 99%

Boosting the in-plane thermal conductivity of nanofibrillated cellulose films: alignment engineering of cross-linked AlN whiskers

Niu,

Zhao,

Wang

et al. 2023

J. Mater. Chem. A

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Section: Introductionmentioning

confidence: 99%

Boosting the in-plane thermal conductivity of nanofibrillated cellulose films: alignment engineering of cross-linked AlN whiskers

Niu,

Zhao,

Wang

et al. 2023

J. Mater. Chem. A

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“…To address these issues, heat sources such as chips are attached on heat sinks using thermal interface materials (TIMs) to dissipate the heat. Composites filled with thermally conductive (TC) materials such as AlN [2], Al 2 O 3 [3], h-BN [4][5][6], and carbon allotropes [7,8] are widely used as TIMs because of their high thermal conductivity. Given that air trapping hampers the heat transfer from heat sources to heat sinks, softer TIMs, which readily wet the surfaces of the components, are required to dissipate the heat efficiently.…”

Section: Introductionmentioning

confidence: 99%

Fabrication and peeling behavior of thermally conductive pressure-sensitive adhesive films with embedded graphite composite patterns

Oh,

Baek,

Yun

et al. 2023

Funct. Compos. Struct.

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Thermal interface materials (TIMs) have been widely employed to address the thermal issues arising in electronics. Given that heat generated at heat sources is dissipated into heat sinks through TIMs, the softer they are, the more efficient the heat transfer is. In this paper, a thermally conductive pressure-sensitive adhesive film (gr-PSA film) in which graphite composites patterns were embedded was fabricated and its thermal conductivity and peeling behavior were investigated. Because of its low storage modulus (2.4 × 104 Pa), a mixture of soft polyurethane acrylate, butyl acrylate, and 2-ethylhexyl acrylate was used to fabricate a pressure-sensitive adhesive. The in-plane and through-plane thermal conductivity of the gr-PSA film were measured as 1.56 (± 0.37) Wm−1K−1 and 0.25 (± 0.03) Wm−1K−1, respectively. The peeling behavior of the gr-PSA tape was investigated by a 90º peel test and the results were compared with simulation results obtained by cohesive zone modeling implemented in the finite element method. Both results show that the peel force oscillated when the gr-PSA tape was peeled. Because the gr-PSA tape comprises alternating stiff and compliant segments, more force is needed peeling when bending the stiff segments.

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“…[4][5][6] To address these critical issues, the appearance of thermal management materials (TMMs) and preparation of high thermal conductivity (λ) is urgent and becomes a key means to reduce heat generation in electronic equipment. [7][8][9] TMMs play a very important role in electronic devices. If heat cannot be effectively transmitted, it may reduce equipment performance, shorten lifespan, and even damage components.…”

Section: Introductionmentioning

confidence: 99%

Enhancing Thermal Conductivity, Electrical Insulation, and Mechanical Strength of Polydimethylsiloxane Composites with Sandwich Structure

An,

Li,

Liu

et al. 2023

Adv Eng Mater

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In this article, boron nitride (BN)/carbon nanotube (CNT)/boron nitride (BN) (BCB) film of sandwich structure is prepared by vacuum‐assisted filtration. Compared with the thermal conductivity (λ) of BNs–cellulose nanocrystals (CNCs) (BC) film, the λ of sandwich structured BCB films with the same thickness (The preparation process consists of one layer of BC and one layer of CNTs–CNCs (CC) until the completion of three layers of filtration) has been significantly improved. Then, the polydimethylsiloxane (PDMS) matrix is infiltrated into the BCB films by the ultrasonic‐assisted forced infiltration method. Prepared BN/CNT/BN/PDMS (BCBP) composites with sandwich structure have excellent λ and mechanical performance. When the weight ratio of BNs to CNCs is 20:1, the λ of BCBP20:1 attains 5.253 W (m K)−1, compared with other thermally conductive composites with the same thickness (0.1 mm), it has an obvious increase. Besides, the dielectric properties and mechanical flexibility of BCBP are also systematically analyzed. This sandwich structure is prepared in such a method that the BCBP will not cause short circuits in electronic devices under high temperatures while having high λ.

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Novel in-situ constructing approach for vertically aligned AlN skeleton and its thermal conductivity enhancement effect on epoxy

Cited by 10 publications

References 63 publications

Boosting the in-plane thermal conductivity of nanofibrillated cellulose films: alignment engineering of cross-linked AlN whiskers

Boosting the in-plane thermal conductivity of nanofibrillated cellulose films: alignment engineering of cross-linked AlN whiskers

Fabrication and peeling behavior of thermally conductive pressure-sensitive adhesive films with embedded graphite composite patterns

Enhancing Thermal Conductivity, Electrical Insulation, and Mechanical Strength of Polydimethylsiloxane Composites with Sandwich Structure

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