In this study we explored p-type δ-doping for the deposition of N-polar p-GaN films at 900 °C, for application in device structures containing high In composition active layers. Various δdoping process parameters were investigated, including the duration and molar flow of the Mg precursor during each pulse as well as the δ-doping period. The results were compared to those obtained for layers grown using continuous doping. As the δ-doping period was reduced from 25 to 5 nm, the p-GaN bulk resistivity decreased from 6.8 to 2.8 W cm. The p-layer resistivity rose with increasing [Mg] independent of the doping scheme. For similar average [Mg], however, continuous doping resulted in a lower resistivity compared to δ-doping. This effect was more pronounced at higher [Mg], indicating that high local concentrations of Mg resulted in degradation of the electrical performance. After optimization of the p-layer structure and contact fabrication process, a minimum contact resistance of 2.77 mW cm 2 and a minimum resistivity of 1.33 W cm were achieved.