2012
DOI: 10.1007/s00542-012-1468-2
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Novel full range vacuum pressure sensing technique using free decay of trapezoid micro-cantilever beam deflected by electrostatic force

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Cited by 9 publications
(4 citation statements)
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“…Sample dimensions were as follows: frame (20 mm × 20 mm), paddle plate (5 mm × 5 mm), and length of tapered beam (3 mm) varying in width (3.3 mm wide at the root narrowing to 1.5 mm where it connects to the paddle plate), as shown in Figure 1 b. According to [ 7 , 12 , 16 , 17 , 18 , 19 ], standard etching techniques and Si IC prototyping were used to fabricate crystalline silicon with highly conductive properties. Figure 2 presents a cross-section of the chip with measurements of the constituent parts.…”
Section: Methods and Experimental Designmentioning
confidence: 99%
“…Sample dimensions were as follows: frame (20 mm × 20 mm), paddle plate (5 mm × 5 mm), and length of tapered beam (3 mm) varying in width (3.3 mm wide at the root narrowing to 1.5 mm where it connects to the paddle plate), as shown in Figure 1 b. According to [ 7 , 12 , 16 , 17 , 18 , 19 ], standard etching techniques and Si IC prototyping were used to fabricate crystalline silicon with highly conductive properties. Figure 2 presents a cross-section of the chip with measurements of the constituent parts.…”
Section: Methods and Experimental Designmentioning
confidence: 99%
“…Each wafer consists of 9 test chips after fabrication. The detail of the fabrication process sequence can be found in the literature [5,6]. The structure can be metallized from both sides.…”
Section: A Sample Design and Fabricationmentioning
confidence: 99%
“…Electrostatic cantilevers have been very popular due to their low-power requirements, small dimensions, and ease of fabrication. They have been used as a pressure sensor [ 1 , 2 ], as a microwave switch [ 3 , 4 , 5 , 6 ], as an air flow sensor [ 7 , 8 , 9 ], as an inkjet head [ 10 , 11 , 12 ], as chemical and biological sensors [ 13 , 14 , 15 ], and as an energy harvester for Microelectromechanical System (MEMS) devices [ 16 , 17 , 18 ].…”
Section: Introductionmentioning
confidence: 99%