“…The abilities to fully recover the original shape after repetitive loading and unloading, by virtue of stress-induced martensitic transformation (SIMT), have made NiTi a favorable material in micro-electromechanical-systems (MEMS) [1][2][3][4]. Particularly, the packaging of MEMS devices is a challenge for the design engineers because a good hermetic sealing without damaging the materials or microelectronics during the joining process is required [2,5].…”