Abstract:With the decrease in pitch in the line/space patterning, micro-bridge defects have become the major defect in the immersion applications. As a result, reducing micro-bridge defect count is one of the key tasks for mass production of semiconductor devices using immersion lithography for both topcoat and non-topcoat processes. In this paper, we focus on the non-topcoat approach particularly the embedded barrier layer (EBL) technology1-4. The advanced EBL materials discussed in this paper have demonstrated to be … Show more
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