2008
DOI: 10.1117/12.805299
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Novel embedded barrier layer materials for ArF non-topcoat immersion applications

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Cited by 3 publications
(5 citation statements)
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“…Our approach to stabilize perpendicular orientations in high-χ BCPs uses a minor formulation additive that is both neutral to the high-χ BCP and able to segregate to and remain anchored at the top of the film during thermal annealing. , This formulation strategy enables perpendicular orientation of high-χ lamellar block copolymers without application of an external top coat and using conventional high temperature thermal annealing, thus simplifying the process and providing potential for high throughput track compatible manufacturing. The approach was inspired by Dow’s “embedded barrier layer” technology, which utilizes a surface active additive to segregate to the top of a photoresist film providing a barrier against leaching of resist components into the immersion fluid during exposure and to modulate surface energy for the immersion process. The embedded barrier materials are minor additives in resist formulations that migrate to the top of the film during spin coating and act as a small molecule diffusion barrier layer on top of the resist.…”
Section: Resultsmentioning
confidence: 99%
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“…Our approach to stabilize perpendicular orientations in high-χ BCPs uses a minor formulation additive that is both neutral to the high-χ BCP and able to segregate to and remain anchored at the top of the film during thermal annealing. , This formulation strategy enables perpendicular orientation of high-χ lamellar block copolymers without application of an external top coat and using conventional high temperature thermal annealing, thus simplifying the process and providing potential for high throughput track compatible manufacturing. The approach was inspired by Dow’s “embedded barrier layer” technology, which utilizes a surface active additive to segregate to the top of a photoresist film providing a barrier against leaching of resist components into the immersion fluid during exposure and to modulate surface energy for the immersion process. The embedded barrier materials are minor additives in resist formulations that migrate to the top of the film during spin coating and act as a small molecule diffusion barrier layer on top of the resist.…”
Section: Resultsmentioning
confidence: 99%
“…We initially removed the ENL with RIE before staining, but we later found the Pt-stain could effectively penetrate the ENL layer to decorate the P2VP domains and impart etch resistance . The observation that the stain can penetrate through the ENL in this system is particularly noteworthy; in photoresists for 193 nm immersion lithography, one of the main functions of the embedded barrier layer is to create a protective barrier that prevents leaching of resist components into the immersion fluid (water). Without the ENL, an island/hole morphology was observed, suggesting alignment parallel to the substrate (Figure a). However, when the ENL was present in the formulation, the desired perpendicular orientation was achieved.…”
Section: Resultsmentioning
confidence: 99%
“…So-called embedded top coats or barrier layers have been applied to address a number of challenges in 193 nm immersion and EUV lithography , or in controlling block copolymer alignment . In addition, the employment of a resist topcoat has been proposed as an effective method to reduce the effects of out-of-band radiation (OOB) in EUV lithography which has been shown to degrade imaging performance .…”
Section: Results and Discussionmentioning
confidence: 99%
“…In order to introduce brevity, the LSEPs prepared in this report will be referred to as LSEP-T1: poly(ECPMA 32 -stat-BzMA 34 )-TFEMA; LSEP-H1: poly(ECPMA 32 -stat-BzMA 34 )-HFACHMA; LSEP-T18 poly(ECPMA 32 -stat-BzMA 34 )-b-TFEMA 18 ; LSEP-H26: poly(ECPMA 32 -stat-BzMA 34 )-b-HFACHMA 26 .…”
Section: ■ Results and Discussionmentioning
confidence: 99%
“…Methacrylates are common building blocks of copolymer materials used for photoresists in the semiconductor industry . These polymers are produced by means of radical chain polymerization.…”
Section: Introductionmentioning
confidence: 99%