2008
DOI: 10.1109/led.2008.2000604
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Novel Delta-Doped InAlGaP/GaAs Heterojunction Bipolar Transistor

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Cited by 11 publications
(4 citation statements)
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“…The speedily widening market for wireless communication devices in the past has increased the need for GaAs-based epitaxial materials. [1][2][3] Field-effect transistors ͑FETs͒ are important in today's high frequency communication systems. 4 The development of high electron mobility transistors ͑HEMTs͒ in the late 1970s in the AlGaAs/GaAs materials system gave device designers the opportunity to exploit the high mobility of undoped GaAs to improve fieldeffect transistor performance.…”
mentioning
confidence: 99%
“…The speedily widening market for wireless communication devices in the past has increased the need for GaAs-based epitaxial materials. [1][2][3] Field-effect transistors ͑FETs͒ are important in today's high frequency communication systems. 4 The development of high electron mobility transistors ͑HEMTs͒ in the late 1970s in the AlGaAs/GaAs materials system gave device designers the opportunity to exploit the high mobility of undoped GaAs to improve fieldeffect transistor performance.…”
mentioning
confidence: 99%
“…GaInP has low reactivity with oxygen, low carrier surface recombination velocity, high ratio of valence band discontinuity to conduction band discontinuity and low density of DX centres compared to AlGaAs. The GaInP/GaAs systems are emerging as promising substitutes for the fabrication of novel electronic and optoelectronic devices [1][2][3][4][5][6]. Efforts have been made to study the basic electronic and optoelectronic properties of the GaInP/GaAs heterostructures and also to demonstrate their differences with AlGaAs/GaAs systems [7][8][9][10].…”
Section: Introductionmentioning
confidence: 99%
“…Here, control of the high-k/III-V interface is the key issue. For this purpose, direct deposition of high-k insulators (mostly Al 2 O 3 ) by atomic layer deposition (ALD) on GaAs and InGaAs surfaces is drawing much attention [1][2][3][4] since the encouraging report on GaAs [1]. However, a recent detailed study on ALD Al 2 O 3 /GaAs interface [4] indicated existence of strong Fermi level pinning, and one is not sure whether such an direct deposition approach is a viable one for fabrication of high performance MIS devices.…”
mentioning
confidence: 99%