Digest. International Electron Devices Meeting,
DOI: 10.1109/iedm.2002.1175953
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Novel collector design for high-speed SiGe:C HBTs

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Cited by 92 publications
(36 citation statements)
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“…The circuit was designed in IHP's 0.25 µm SiGe:C BiCMOS technology SG25H1 which offers transit frequencies around 200 GHz [5]. In this process the HBT module is introduced after gate spacer formation and before CMOS source/drain implantation.…”
Section: Sige:c Technology and Devicesmentioning
confidence: 99%
“…The circuit was designed in IHP's 0.25 µm SiGe:C BiCMOS technology SG25H1 which offers transit frequencies around 200 GHz [5]. In this process the HBT module is introduced after gate spacer formation and before CMOS source/drain implantation.…”
Section: Sige:c Technology and Devicesmentioning
confidence: 99%
“…The circuits were designed in IHP's 0.25 µm SiGe:C BiCMOS technology SG25H1 which offers transit frequencies f T around 200 GHz [7]. In this process the HBT module is introduced after the gate spacer formation and before CMOS source/drain implantation.…”
Section: Sige:c Bicmos Technologymentioning
confidence: 99%
“…This circuit was designed on a 0.25 µm SiGe:C BiC-MOS technology [4]. In this process the HBT module is introduced after gate spacer formation and before CMOS source/drain implantation.…”
Section: Sige:c Technology and Devicesmentioning
confidence: 99%