Novel Antenna Coupler Design for Production of Meter-Scale High-Density Planar Surface Wave Plasma

Abstract

Additions to the Spectra Lila, Lizb and LiZla.Six new spectral lines have been observed in the lithium spectrum between 200 nm and 600 nm. Possible classifications are given and discussed.

Improved Uniformity of Photoresist Ashing for a Half-Inch Wafer with Double U-shaped Antenna Structure in a Microwave-Excited Water Vapor Plasma

“…However, microwave plasma processes using a slot antenna often have difficulties such as poor uniformity and small processing size. Therefore, various antennas and microwave plasma-generation methods such as the spoke antenna [13], ring slot antenna [14], multislotted planar antenna [15], radial-line antenna [16,17], slotted waveguide antennas [18], long-line shaped antenna [19][20][21], using a dielectric material embedded multi-hollow structures under a slot antenna [22], among others [23][24][25][26][27][28][29][30] have been proposed to improve uniformity and to increase the process size. The approaches associated with these antennas for improving the uniformity and increasing the processing size include changing the antenna arrangement and the shape.…”

Capacitive radio frequency discharges with a single ring-shaped narrow trench of various depths to enhance the plasma density and lateral uniformity

“…Functional thin film preparation for the manufacturing of solar cells and large diameter display panels by plasma enhanced chemical vapor deposition (PECVD) 1,2 and physical sputtering 3,4 as well as the microfabrication of large scale integrated circuits by dry etching 5,6 have been widely performed based on a variety of low gas pressure plasma sources such as capacitively coupled plasmas (CCP), [7][8][9][10][11][12][13][14][15][16][17][18][19] inductively coupled plasmas, [20][21][22] and microwave plasmas. [23][24][25] Among these source concepts, CCPs are particularly useful due to its simple experimental setup and the opportunity to process large-diameter substrates. However, CCPs suffer from low plasma densities compared to other plasma sources.…”

Magnet-free uniform sputtering of dielectric film by RF and microwave power superposition

“…Another possibility of using microwave power for sputtering is to produce plasma in a no-magnetic-field environment, i.e., to use a surface wave plasma (SWP) source. [16][17][18][19][20][21][22][23][24] So far, we have developed various surface wave plasma sources that can produce uniform and high-density (10 17 -10 18 m −3 ) plasmas [25][26][27] and have applied the SWP to plasma chemical vapor deposition (PCVD) [28][29][30] and surface treatment. [31][32][33] Furthermore, we have recently developed a new microwave antenna that can reduce the pressure required for SWP sustainment to less than 1 Pa. 34) Therefore, the improved SWP is suitable for the uniform, high-density and lowpressure plasma operation for the sputtering of insulating materials.…”